FLAT PANEL DISPLAY DEVICE AND ENCAPSULATION SUBSTRATE THEREOF

• US 20110241528A1
• Filed: 01/20/2011
• Published: 10/06/2011
• Est. Priority Date: 04/01/2010
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: CHOI, Jung-Mi
• Granted Patent: US 8,466,616 B2
• Time in Patent Office: Days
• US Class Current: 313/317
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling

Abstract

A flat panel display device having an improved encapsulation structure includes a glass substrate; a light emission unit formed on the glass substrate; an encapsulation substrate formed on the glass substrate; and frit sealing a space between the glass substrate and the cover layer. The encapsulation unit includes a metal layer formed of a metallic material and a cover layer stacked on the metal layer and formed of a glass material in order to cover the light emission unit. In the above encapsulation structure, pressure resistance and vapor permeability resistance of a flat panel device may be improved and thus deterioration of a light emission unit due to permeation of moisture may be prevented. Also, heat radiation capacity may be improved and thus deterioration in performance of a product may be prevented.

Claims

1. A flat panel display device comprising:

a glass substrate;

a light emission unit formed on the glass substrate;

an encapsulation substrate formed on the glass substrate, the encapsulation substrate comprising;

a metal layer formed of a metallic material; and

a cover layer stacked on the metal layer and formed of a glass material in order to cover the light emission unit; and

frit sealing a space between the glass substrate and the cover layer.

2. The flat panel display device of claim 1, wherein the frit is a glass material that is cured when exposed to a laser.

3. The flat panel display device of claim 1, wherein the metal layer comprises stainless steel or aluminum.

4. The flat panel display device of claim 1, wherein the cover layer comprises soda lime glass.

5. The flat panel display device of claim 1, wherein the metal layer is formed on an inner side of the encapsulation substrate so as to face the glass substrate, and

wherein a surface area of the cover layer is greater than a surface area of the metal layer.

6. The flat panel display device of claim 5, wherein a sealant is disposed between the metal layer and the glass substrate.

7. The flat panel display device of claim 5, wherein a desiccant is disposed between the metal layer and the glass substrate.

8. The flat panel display device of claim 5, further comprising:

a sealant is disposed in a partial region extending inwardly from the frit and between the metal layer and the glass substrate; and

a desiccant disposed in a remaining region extending inwardly from the partial region and between the metal layer and the glass substrate.

9. The flat panel display device of claim 1, further comprising a passivation layer formed on the light emission unit and protecting the light emission unit.

13. The flat panel display device of claim 1, wherein:

the cover layer further comprises a frit-contact area on which the metal layer is not stacked, and

the frit is connected to and extends from the frit-contact area to the glass substrate.

10. An encapsulation substrate formed on a glass substrate of a flat panel display device to cover a light emission unit, the encapsulation substrate comprising:

a metal layer formed of a metallic material; and

a cover layer stacked on the metal layer and formed of a glass material in order to cover a light emission unit.

11. The encapsulation substrate of claim 10, wherein the metal layer comprises stainless steel or aluminum.

12. The encapsulation substrate of claim 10, wherein the cover layer comprises soda lime glass.

14. The encapsulation substrate of claim 10, wherein:

the cover layer further comprises a frit-contact area on which the metal layer is not stacked, and

when sealing the encapsulation substrate to the glass substrate, frit is connected to and extends from the frit-contact area to the glass substrate.