OPTO-ELECTRONIC TRANSCEIVER MODULE SYSTEM

• US 20110243509A1
• Filed: 04/05/2010
• Published: 10/06/2011
• Est. Priority Date: 04/05/2010
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies Fiber IP Singapore PTE Limited (Broadcom, Inc.)
• Inventors: Su, Chung-yi, Wang, Tak Kui
• Application Number:
  US12/754,148
• Publication Number:
  US 20110243509A1
• Time in Patent Office: Days
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48177 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15747 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

An opto-electronic module system includes an opto-electronic module having an optics engine module mounted on an opto-electronic module substrate. The optics engine module includes an opto-electronic light source and an opto-electronic light receiver mounted on an optics engine module substrate. The opto-electronic module substrate has an aperture that is aligned with the opto-electronic light source and the opto-electronic light receiver.

Claims

1. An opto-electronic module system, comprising:

an opto-electronic module comprising;

an opto-electronic module substrate having an upper surface, a lower surface, and an aperture extending between the upper surface and lower surface of the opto-electronic module substrate; and

an optics engine module, the optics engine module comprising an optics engine module substrate having an upper surface and a lower surface, an opto-electronic light source mounted on the upper surface of the optics engine module substrate and an opto-electronic light receiver mounted on the upper surface of the optics engine module substrate, the optics engine module substrate made of a material transparent to frequencies of light produced by the opto-electronic light source and transparent to frequencies of light sensed by the opto-electronic light receiver, the optics engine module mounted over the aperture of the opto-electronic module substrate in an orientation with the lower surface of the optics engine module substrate in contact with the upper surface of the opto-electronic module substrate and wherein a first optical path between the opto-electronic light source and the aperture of the opto-electronic module substrate passes through the material of the optics engine module substrate and wherein a second optical path between the opto-electronic light receiver and the aperture of the opto-electronic module substrate passes through the material of the optics engine module substrate.

2. The opto-electronic module system claimed in claim 1, wherein:

the opto-electronic module further comprises a dielectric overmold extending over the opto-electronic module substrate and encapsulating the optics engine module; and

the optics engine module is mounted on the opto-electronic module substrate by a bead of adhesive surrounding the aperture of the opto-electronic module substrate and sealing the aperture between the optics engine module and the opto-electronic module substrate.

3. The opto-electronic module system claimed in claim 2, wherein the opto-electronic module further comprises:

a buffer integrated circuit mounted on the optics engine module substrate;

a first plurality of wirebonds electrically connecting the buffer integrated circuit to conductors on the opto-electronic module substrate; and

a second plurality of wirebonds electrically connecting the buffer integrated circuit to the optics engine module;

wherein the dielectric overmold encapsulates the optics engine module, the buffer integrated circuit, the first plurality of wirebonds, and the second plurality of wirebonds.

4. The opto-electronic module system claimed in claim 1, wherein the opto-electronic module substrate comprises a lead frame.

5. The opto-electronic module system claimed in claim 1, wherein the opto-electronic module further comprises an array of electrical contacts on the lower surface of the opto-electronic module substrate.

6. The opto-electronic module system claimed in claim 5, wherein the array of electrical contacts is a ball grid array (BGA).

7. The opto-electronic module system claimed in claim 1, wherein the optics engine module further comprises:

a first lens aligned with the opto-electronic light source; and

a second lens aligned with the opto-electronic light receiver.

8. The opto-electronic module system claimed in claim 1, further comprising a circuit board substrate having a surface and an edge, the edge having a slot extending from within the circuit board substrate to the surface of the circuit board substrate, wherein the opto-electronic module is mounted on the circuit board substrate in an orientation with the aperture of the opto-electronic module substrate disposed over the slot in the edge of the circuit board substrate.

9. The opto-electronic module system claimed in claim 8, further comprising an optical connector mateable with the slot, the optical connector having a connector first optical axis aligned with an optical fiber port, a connector second optical axis perpendicular to the connector first optical axis, and a mirror oriented at a 45-degree angle to the connector first optical axis and the connector second optical axis, wherein the connector second optical axis is aligned with one of the opto-electronic light source and opto-electronic light receiver when the optical connector is mated with the slot.

10. A method of operation of an opto-electronic module system, the opto-electronic module system comprising an opto-electronic module, the opto-electronic module comprising an opto-electronic module substrate and an optics engine module, the opto-electronic module substrate having an upper surface, a lower surface, and an aperture extending between the upper surface and lower surface of the opto-electronic module substrate, the optics engine module comprising an optics engine module substrate having an upper surface and a lower surface, an opto-electronic light source mounted on the upper surface of the optics engine module substrate and an opto-electronic light receiver mounted on the upper surface of the optics engine module substrate, the optics engine module substrate made of a material transparent to frequencies of light produced by the opto-electronic light source and transparent to frequencies of light sensed by the opto-electronic light receiver, the optics engine module mounted over the aperture of the opto-electronic module substrate in an orientation with the lower surface of the optics engine module substrate in contact with the upper surface of the opto-electronic module substrate, the method comprising:

the opto-electronic light source emitting light through the optics engine module substrate and into the aperture; and

the opto-electronic light receiver receiving light through the material of the optics engine module substrate from the aperture.

11. The method claimed in claim 10, wherein:

the opto-electronic module further comprises a dielectric overmold extending over the opto-electronic module substrate and encapsulating the optics engine module; and

the optics engine module is mounted on the opto-electronic module substrate by a bead of adhesive surrounding the aperture of the opto-electronic module substrate and sealing the aperture between the optics engine module and the opto-electronic module substrate.

12. The method claimed in claim 11, wherein the opto-electronic module further comprises:

a buffer integrated circuit mounted on the optics engine module substrate;

a first plurality of wirebonds electrically connecting the buffer integrated circuit to conductors on the opto-electronic module substrate; and

a second plurality of wirebonds electrically connecting the buffer integrated circuit to the optics engine module;

wherein the dielectric overmold encapsulates the optics engine module, the buffer integrated circuit, the first plurality of wirebonds, and the second plurality of wirebonds.

13. The method claimed in claim 10, wherein the opto-electronic module substrate comprises a lead frame.

14. The method claimed in claim 10, wherein the opto-electronic module further comprises an array of electrical contacts on the lower surface of the opto-electronic module substrate.

15. The method claimed in claim 14, wherein the array of electrical contacts is a ball grid array (BGA).

16. The method claimed in claim 10, wherein the optics engine module further comprises:

a first lens aligned with the opto-electronic light source; and

a second lens aligned with the opto-electronic light receiver.

17. The method claimed in claim 10, wherein the opto-electronic module system further comprises a circuit board substrate having a surface and an edge, the edge having a slot extending from within the circuit board substrate to the surface of the circuit board substrate, wherein the method further comprises, and the opto-electronic module is mounted on the circuit board substrate in an orientation with the aperture of the opto-electronic module substrate disposed over the slot in the edge of the circuit board substrate, and wherein the method further comprises receiving an optical connector in the slot, the optical connector having a connector first optical axis aligned with an optical fiber port, a connector second optical axis perpendicular to the connector first optical axis, and a mirror oriented at a 45-degree angle to the connector first optical axis and the connector second optical axis, wherein the connector second optical axis is aligned with one of the opto-electronic light source and opto-electronic light receiver when the optical connector is received in the slot.

18. The method claimed in claim 10, wherein the opto-electronic module system comprises a first opto-electronic module mounted on a first side of a structure and a second opto-electronic module mounted on a second side of a structure, the structure having a structure opening extending from the first side to the second side, the method further comprising:

the first opto-electronic module emitting a first optical signal into the structure opening; and

the second opto-electronic module receiving the first optical signal through the structure opening.

19. The method claimed in claim 18, wherein the structure comprises a first circuit board having a first opening and a second circuit board having a second opening, the first circuit board mounted parallel to the second circuit board with the first opening aligned with the second opening, the first opto-electronic module mounted on the first circuit board over the first opening, and the second opto-electronic module mounted on the second circuit board over the second opening, the method comprising:

the first opto-electronic module emitting a first optical signal into the first opening; and

the second opto-electronic module receiving the first optical signal through the second opening.