TOUCH PAD

• US 20110247883A1
• Filed: 05/26/2010
• Published: 10/13/2011
• Est. Priority Date: 04/13/2010
• Status: Active Grant

• Current Assignee: Sentelic Corporation
• Original Assignee: Sentelic Corporation
• Inventors: Yu, Chih-Chieh, Chu, Abel Lin, Lin, Jao-Ching, Shen, Chung-Yi
• Granted Patent: US 8,410,370 B2
• Time in Patent Office: Days
• US Class Current: 178/18.03
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A touch pad including a printed circuit board, a plurality of column-conductor groups and a plurality of row-column groups. The printed circuit board is formed with an upper surface and a lower surface. The column-conductor groups include a plurality of first column-conductors and a plurality of second column-conductors. The row-conductor groups include a plurality of first row-conductors and a plurality of second row-conductors. The first column-conductors and the first row-conductors are provided on the upper surface. The second column-conductors and the second row-conductors are respectively provided on one and the other of the upper surface and the lower surface, and electrically connected to each other through column-vias and row-vias. Whereby the structure, the existing material and process can be still be used, and the problem of crossed wires can be avoided, also the yield of products can be increased with less waste of materials.

Claims

1. A touch pad, comprising:

a printed circuit board having an upper surface and a lower surface;

a plurality of column-conductor groups including plural first column-conductors provided on the upper surface and plural second column-conductors provided on one of the upper surface and the lower surface and electrically connected to the first column-conductors; and

a plurality of row-conductor groups including plural first row-conductors provided on the upper surface and plural second row-conductors provided on the other of the upper surface and the lower surface and electrically connected to the first row-conductors.

2. The touch pad according to claim 1, wherein the first column-conductors and the second column-conductors and the first row-conductors and the second row-conductors are capacitance-type sensors capable of generating signals when being touched.

3. The touch pad according to claim 1, wherein the second column-conductors are provided on the lower surface, and the second row-conductors are provided on the upper surface, the second column-conductors and the second row-conductors are arranged on either side of the printed circuit board in a crisscross manner.

4. The touch pad according to claim 3, wherein the printed circuit board has a plurality of column-vias penetrating through the printed circuit board and electrically connected with the first column-conductors and the second column-conductors, each of the second column-conductors is electrically connected with the two upper sequentially arranged first column-conductors through at least two row-vias.

5. The touch pad according to claim 1, wherein the second row-conductors are provided on the lower surface, the second column-conductors are provided on the upper surface, the second row-conductors are separated from the second column-conductors by the printed circuit board, and both of them are arranged on either side of the printed circuit board in a crisscross manner.

6. The touch pad according to claim 5, wherein the printed circuit board has a plurality of row-vias penetrating through the printed circuit board and electrically connected with the first row-conductors and the second row-conductors, each of the second row-conductors is electrically connected with the first row-conductors and the second row-conductors, and each of the second row-conductors is electrically connected with the two upper sequentially arranged first row-conductors through at least two row-vias.

7. The touch pad according to claim 1, wherein a portion of the second column-conductors are provided on the upper surface, the rest of the second column-conductors are provided on the lower surface, a portion of the second row-conductors are provided on the upper surface, the rest of the second row-conductors are provided on the lower surface, so that the second column-conductors and the second row-conductors are arranged on both sides of the printed circuit board in a crisscross manner.

8. The touch pad according to claim 1, wherein the area of the first column-conductors and the area of the first row-conductors are larger than the area of the second column-conductors and the area of the second row-conductors respectively.

9. The touch pad according to claim 1, further comprising a control chip provided on the lower surface.

10. The touch pad according to claim 9, wherein the printed circuit board has two corresponding sides provided with plural chip-connected-column-vias and plural chip-connected-row-vias respectively, each of the chip-connected-column-vias is electrically connected to the control chip through a first chip-lead, and each of the chip-connected-row-vias is electrically connected to the control chip through a second chip-lead.

11. The touch pad according to claim 1, wherein the column-conductors and the row-conductors are integrally formed by etching copper clad.