METAL DEPOSITION METHOD AND LASER METAL DEPOSITION APPARATUS

• US 20110248001A1
• Filed: 03/28/2011
• Published: 10/13/2011
• Est. Priority Date: 04/01/2010
• Status: Abandoned Application

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Miyagi, Masanori, Tsukamoto, Takeshi, KAWANAKA, Hirotsugu
• Application Number:
  US13/072,835
• Publication Number:
  US 20110248001A1
• Time in Patent Office: Days
• US Class Current: 219/76.1
• CPC Class Codes: B23K 2101/001 Turbines
• CPC Class Codes: B23K 2101/34 Coated articles , e.g. plated or painted; Surface treated articles
• CPC Class Codes: B23K 2103/08 Non-ferrous metals or alloys
• CPC Class Codes: B23K 26/144 the fluid stream containing particles, e.g. powder
• CPC Class Codes: B23K 26/342 Build-up welding
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: C30B 11/00 Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method C30B13/00, C30B15/00, C30B17/00, C30B19/00 take precedence; under a protective fluid C30B27/00
• CPC Class Codes: C30B 11/003 Heating or cooling of the melt or the crystallised material
• CPC Class Codes: C30B 11/005 by irradiation or electric discharge
• CPC Class Codes: C30B 11/04 adding crystallising materials or reactants forming it in situ to the melt
• CPC Class Codes: C30B 29/02 Elements
• CPC Class Codes: C30B 29/52 Alloys

Abstract

In a deposition method of forming a buildup on a single crystal or directionally solidified crystal parent material, metal deposition is performed from an extension in a preferential growth orientation of parent material crystals while forcedly cooling a portion of the parent material somewhat below a processed surface and beforehand giving a temperature gradient to the parent material so that a maximum temperature gradient is oriented along the preferential growth orientation of parent material crystals.

Claims

1. A metal deposition method of forming a buildup on a single crystal or directionally solidified crystal parent material, the method characterized by comprising:

setting a processed surface into an up side;

cooling by means of cooling means (5;

9;

300) a portion on a parent material side with respect to the processed surface; and

depositing a metal from an extension in a preferential growth orientation of parent material crystals while beforehand giving a temperature gradient to the parent material side so that a maximum temperature gradient is oriented along the preferential growth orientation of parent material crystals.

2. The metal deposition method according to claim 1, characterized in that laser welding is used to repeatedly perform metal deposition to form the buildup.

3. The metal deposition method according to claim 1, characterized in that metal deposition is performed while indirectly cooling a parent material side by bringing a cooling jig (5), which is provided with a refrigerant flow passage, into close contact with the parent material side from the processed surface and causing a refrigerant to flow through the jig flow passage.

4. The metal deposition method, according to claim 1, characterized in that metal deposition is performed while directly cooling a parent material side by immersing the parent material side from the processed surface in a refrigerant, or jetting a refrigerant against the parent material side of the parent material.

5. The metal deposition method according to claim 1, characterized in that metal deposition is performed while directly cooling a parent material side by causing a refrigerant to flow through a flow passage in the parent material.

6. The metal deposition method according to claim 4, characterized in that metal deposition is performed while using a shielding mechanism (93;

301) to prevent a refrigerant from directly interfering with a processed portion.

7. The metal deposition method according to claim 3, characterized in that when a refrigerant used to beforehand give a temperature gradient to a parent material side is .circulated, cooling is achieved to form the buildup while using a heat exchange mechanism (8) to adjust temperature of the refrigerant.

8. The metal deposition method according to claim 2, characterized in that in order to keep a defocusing distance constant, metal deposition is performed repeatedly by measuring the height of the buildup immediately after metal deposition and performing a leveling processing of measurement data to determine a processing position of a succeeding layer.

9. A laser metal deposition apparatus for forming a buildup on a single crystal or directionally solidified crystal parent material, the apparatus being characterized by comprising:

a laser welding head (12) for irradiating laser on a processed surface;

a nozzle (100) for supplying of a filler metal and shielding gases to the processed surface; and

cooling means (5;

9;

300) for forced cooling a parent material side.

10. The laser metal deposition apparatus according to claim 9, characterized by comprising a cooling jig (5) having a refrigerant flow passage, said cooling jig being arranged into close contact with a parent material side from the processed surface in order to indirectly and forcedly cool the parent material side by means, which causes a refrigerant to flow through the refrigerant flow passage of the cooling jig.

11. The laser metal deposition apparatus according to claim 9, characterized by comprising a refrigerant vessel (300) containing a refrigerant, into which a parent material side from the processed surface is immersed for directly and forcedly cooling the parent material side.

12. The laser metal deposition apparatus according to claim 9, characterized by comprising a cooling apparatus (9) for direct cooling of a parent material side by means (91, 92), which jets a refrigerant against the parent material side from the processed surface.

13. The laser metal deposition apparatus according to claim 11, characterized by further comprising a shielding mechanism (93;

301) to prevent a refrigerant from directly interfering with the processed portion.

14. The laser metal deposition apparatus according to claim 9, characterized by comprising an apparatus (8) for circulating the refrigerant and a mechanism (8) for adjusting temperature of the refrigerant by means of heat exchange at the time of circulation of the refrigerant.

15. The laser metal deposition apparatus according to claim 9, characterized by comprising a mechanism for measuring the height of the buildup immediately after metal deposition, a logic circuit mechanism for leveling processing of measurement data, and a logic circuit and a control unit, by which positioning is achieved so that a distance between a processing position and a laser head for laser irradiation is made a predetermined length from position information as leveled.