SENSOR SUBSTRATE SYSTEMS AND METHODS
First Claim
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1. A sensing apparatus comprising:
- a substrate having a first side for a sensing element and a second side for electronics; and
the substrate having at least one via from the first side of the substrate to the second side of the substrate;
wherein the at least one via is hermetically sealed from the first side of the substrate to the second side of the substrate; and
wherein the at least one via is at least partially filled with an optically transmissive material.
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Abstract
A sensing apparatus may include a substrate having a first side for a sensing element and a second side for electronics, the substrate may have a at least one via from the first side of the substrate to the second side of the substrate, the at least one via may be hermetically sealed with an optically transmissive material.
31 Citations
21 Claims
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1. A sensing apparatus comprising:
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a substrate having a first side for a sensing element and a second side for electronics; and the substrate having at least one via from the first side of the substrate to the second side of the substrate; wherein the at least one via is hermetically sealed from the first side of the substrate to the second side of the substrate; and
wherein the at least one via is at least partially filled with an optically transmissive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of manufacturing a sensing apparatus, the method comprising:
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providing a substrate having a first side for a sensing element and a second side for electronics; forming a at least one via from the first side of the substrate to the second side of the substrate; and filling the at least one via at least partially with an optically transmissive material such that the at least one via is hermetically sealed from the first side of the substrate to the second side of the substrate. - View Dependent Claims (21)
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Specification