METHOD FOR TRANSFERRING A UNIFORM PHOSPHOR LAYER ON AN ARTICLE AND LIGHT-EMITTING STRUCTURE FABRICATED BY THE METHOD

• US 20110248305A1
• Filed: 04/11/2011
• Published: 10/13/2011
• Est. Priority Date: 05/15/2009
• Status: Active Grant

• Current Assignee: Achrolux Inc., Archilux Inc.
• Original Assignee: Archilux Inc.
• Inventors: Ling, Peiching
• Granted Patent: US 8,994,050 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

A method of transferring a uniform phosphor layer on an article and a light-emitting structure having a uniform phosphor layer. The method includes disposing a surface of the article in a proximity of a carrier having the uniform phosphor layer on a surface thereon, and causing the uniform phosphor layer to be secured to the surface of the article. Therefore, the uniform phosphor layer is secured to the articles according to a contour of the article.

Claims

1. A method for transferring a uniform phosphor layer on an article, comprising the steps of:

providing a carrier having the uniform phosphor layer formed on a surface thereof;

disposing a surface of the article in a proximity of the uniform phosphor layer; and

causing the uniform phosphor layer to be attached and secured to the surface of the article.

2. The method of claim 1, wherein the uniform phosphor layer is attached and secured to the surface of the article by applying a vacuum to a space between the article and the carrier.

3. The method of claim 1, wherein the carrier comprises a body and a release film disposed thereon, and the uniform phosphor layer is positioned on the release film.

4. The method of claim 3, wherein the release film and the uniform phosphor layer are secured to the surface of the article together, and the method further comprises removing the release film.

5. The method of claim 1, wherein the uniform phosphor layer comprises phosphor powders and a binder material.

6. The method of claim 5, wherein the phosphor powders in the uniform phosphor layer occupy more than 75% in volume of the uniform phosphor layer.

7. The method of claim 1, wherein the uniform phosphor layer comprises phosphor powders constituted by a plurality of phosphor particles, none of which is completely separated from adjacent ones.

8. The method of claim 1, wherein the carrier further comprises a binder layer formed on the uniform phosphor layer, and the uniform phosphor layer is secured on the surface of the article through the binder layer.

9. The method of claim 1, wherein the article is an LED wafer, an LED die, an LED package or a lens.

10. The method of claim 9, wherein the article is an LED package comprising:

a substrate having a recess;

an LED die disposed in the bottom of the recess; and

an encapsulant formed in the recess and covered the LED die,

wherein the uniform phosphor layer is attached and secured to the surface of the encapsulant.

11. The method of claim 9, wherein the article is a lens, and the method further comprises bonding the uniform phosphor layer on the lens onto an LED package.

12. The method of claim 1, wherein the article further has at least one metal pad formed on the surface thereof in proximity of the uniform phosphor layer, and the method further comprises patterning the uniform phosphor layer to expose the metal pad therefrom following the uniform phosphor layer being secured to the surface of the article.

13. The method of claim 12, wherein the article further has a pedestal formed on the at least metal pad, and the pedestal is removed in the step of patterning the uniform phosphor layer.

14. The method of claim 1, wherein the article further has at least one metal pad and a pedestal formed thereon on the surface thereof in proximity of the uniform phosphor layer, and the method further comprises patterning the uniform phosphor layer to expose the pedestal following the uniform phosphor layer being secured to the surface of the article.

15. The method of claim 1, wherein the article further has at least one metal pad formed on the surface thereof in proximity of the uniform phosphor layer, the uniform phosphor layer formed on the carrier has at least one opening corresponding to the metal pad, and the metal pad is exposed through the opening following the uniform phosphor layer being secured to the surface of the article.

16. The method of claim 15, wherein the article further has a pedestal formed on the at least metal pad, and the method further comprises removing the pedestal following the uniform phosphor layer being secured to the surface of the article.

17. The method of claim 15, wherein the uniform phosphor layer having the opening is formed by:

deposing on the carrier a first mask having a backbone, a cover part covered on a predetermined site of the opening, and a connection part which connects the backbone and cover part;

forming the uniform phosphor layer on the surface of the carrier by electrostatic charges; and

removing the first mask.

18. The method of claim 17, wherein the connection part is covered on the surface of the carrier, and the uniform phosphor layer is further formed by deposing a second mask on the carrier to expose the surface of the carrier that matches the covered position of the connection part following removing the first mask, and repeating the step of applying electrostatic charges.

19. The method of claim 17, wherein the connection part is positioned above the surface of the carrier.

20. The method of claim 1, wherein the article further has at least one metal pad formed on the surface thereof in proximity of the uniform phosphor layer, the uniform phosphor layer formed on the carrier has at least one opening corresponding to the metal pad and a gap extended from the opening such that a part of the surface of the article is exposed from the gap after attaching the uniform phosphor layer, and the method further comprises making an another uniform phosphor layer to be attached and secured to the exposed surface of the article.

21. The method of claim 1, wherein the carrier and the article are compressed, such that the uniform phosphor layer is secured on the surface of the article.

22. A light-emitting structure having a uniform phosphor layer, comprising:

an light-emitting article having at least one metal pad formed on a surface thereof; and

a uniform phosphor layer that is secured on the surface of the light-emitting article, wherein the uniform phosphor layer has at least one opening corresponding to the metal pad that exposes the metal pad.

23. The light-emitting structure of claim 22, wherein the light-emitting article further comprises a pedestal formed on the at least metal pad, and the pedestal is exposed from the uniform phosphor layer.

24. The light-emitting structure of claim 22, further comprising a binder layer sandwiched between the article and the uniform phosphor layer that secures the uniform phosphor layer on the surface of the article.

25. The light-emitting structure of claim 22, wherein the uniform phosphor layer comprises phosphor powders and a binder material.

26. The light-emitting structure of claim 25, wherein the phosphor powders in the uniform phosphor layer occupy more than 75% in volume of the uniform phosphor layer.

27. The light-emitting structure of claim 22, wherein the uniform phosphor layer comprises phosphor powders constituted by a plurality of phosphor particles, and none of the phosphor particles is completely separate from adjacent ones.

28. The light-emitting structure of claim 22, wherein the article is an LED wafer or an LED die.

29. A light-emitting structure having a uniform phosphor layer, comprising:

an LED package comprising;

a substrate having a recess;

an LED die disposed in the bottom of the recess; and

an encapsulant formed in the recess and covered the LED die; and

a uniform phosphor layer that is secured to the surface of the encapsulant.

30. The light-emitting structure of claim 29, further comprising a lens disposed on the uniform phosphor layer so that the uniform phosphor layer is sandwiched between the encapsulant and lens.

31. The light-emitting structure of claim 30, further comprising a binder layer sandwiched between the encapsulant and the uniform phosphor layer that secures the uniform phosphor layer on the surface of the encapsulant.

32. The light-emitting structure of claim 29, wherein the uniform phosphor layer comprises phosphor powders and a binder material.

33. The light-emitting structure of claim 32, wherein the phosphor powders in the uniform phosphor layer occupy more than 75% in volume of the uniform phosphor layer.

34. The light-emitting structure of claim 29, wherein the uniform phosphor layer comprises phosphor powders constituted by a plurality of phosphor particles, and none of the phosphor particles is completely separate from adjacent ones.