RF AND NFC PAMM ENHANCED ELECTROMAGNETIC SIGNALING

• US 20110250838A1
• Filed: 02/28/2011
• Published: 10/13/2011
• Est. Priority Date: 04/11/2010
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Alexopoulos, Nicolaos G., Kyriazidou, Chryssoula A.
• Granted Patent: US 9,270,030 B2
• Time in Patent Office: Days
• US Class Current: 455/41.1
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 15/0026 said selective devices having a stacked geometry or having multiple layers
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/0093 having a fractal shape
• CPC Class Codes: H01Q 19/10 using reflecting surfaces

Abstract

A communication device includes a processing module, a transmitter section, a receiver section, a wireless communication structure, a projected artificial magnetic mirror (PAMM) array, and a metal backing. The transmitter section and the receiver section are on a first layer. The wireless communication structure is on a second layer, the PAMM array is on a third layer, and the metal backing is on a fourth layer. The PAMM array includes a non-conductive area to support coupling of the wireless communication structure to at least one of the transmitter section and the receiver section. In addition, the PAMM array provides electromagnetic shielding of the at least one of the transmitter section and the receiver section from the wireless communication structure.

Claims

1. A communication device comprises:

a processing module operable to;

convert outbound data into an outbound symbol stream; and

convert an inbound symbol stream into inbound data;

a transmitter section on a first layer and operable to convert the outbound symbol stream into an outbound signal;

a receiver section on the first layer and operable to convert an inbound signal into the inbound symbol stream;

a wireless communication structure on a second layer and operable to;

convert the outbound signal into an outbound wireless signal; and

convert an inbound wireless signal into the inbound signal;

a projected artificial magnetic mirror (PAMM) array on a third layer; and

a metal backing on a fourth layer, wherein the PAMM array includes a feed-through area to support coupling of the wireless communication structure to at least one of the transmitter section and the receiver section.

2. The communication device of claim 1, wherein the PAMM array comprises:

a plurality of conductive coils electrically coupled to the metal backing.

3. The communication device of claim 2 further comprises:

the plurality of conductive coils being of a size, shape, and pattern and being a distance “

d”

from the metal backing to provide electromagnetic signal amplification for the wireless communication structure and to provide electromagnetic signal shielding for the at least one of the transmitter section and the receiver section.

4. The communication device of claim 1, wherein the wireless communication structure comprises:

one or more antenna elements to form one or more antennas.

5. The communication device of claim 1, wherein the wireless communication structure comprises:

one or more near field communication (NFC) coils.

6. The communication device of claim 1 further comprises:

a first die having the first layer for supporting the transmitter and receiver sections; and

a second die having the second and third layers for supporting the wireless communication structure and the PAMM array, respectively, wherein the first and second die are in a flip chip configuration and wherein the fourth layer is of the first die or the second die and is between the first layer and the third layer.

7. The communication device of claim 1 further comprises at least one of:

the processing module on the first layer; and

the processing module on a fifth layer.

8. An antenna circuit comprises:

an antenna structure on a first layer of a substrate;

a projected artificial magnetic mirror (PAMM) array on a second layer of the substrate;

a plurality of circuit components on a third layer of the substrate; and

a metal backing on a fourth layer of the substrate, wherein the PAMM array includes a feed-through area to support coupling of the antenna structure to at least one of the plurality of circuit components.

9. The antenna circuit of claim 8, wherein the PAMM array comprises:

a plurality of conductive coils electrically coupled to the metal backing.

10. The antenna circuit of claim 9 further comprises:

the plurality of conductive coils being of a size, shape, and pattern and being a distance “

d”

from the metal backing to provide electromagnetic signal amplification for the antenna structure and to provide electromagnetic signal shielding for at least one of the plurality of circuit components.

11. The antenna circuit of claim 8, wherein the antenna structure comprises at least one of:

a dipole antenna;

a monopole antenna;

a plurality of discrete antenna elements; and

a multi-layered helical coil antenna.

12. The antenna circuit of claim 11 further comprises:

the PAMM array including an array of modified Polya curve metal patches arranged in rows and columns; and

the antenna structure including a dipole antenna.

13. The antenna circuit of claim 11 further comprises:

the PAMM array including an array of square metal spirals arranged in rows and columns; and

the antenna structure including a dipole antenna.

14. A near field communication (NFC) circuit comprises:

an NFC coil structure on a first layer of a substrate;

a projected artificial magnetic mirror (PAMM) array on a second layer of the substrate;

a plurality of circuit components on a third layer of the substrate; and

a metal backing on a fourth layer of the substrate, wherein the PAMM array includes a feed-through area to support coupling of the NFC coil structure to at least one of the plurality of circuit components.

15. The NFC circuit of claim 14, wherein the PAMM array comprises:

a plurality of conductive coils electrically coupled to the metal backing.

16. The NFC circuit of claim 14 further comprises:

the plurality of conductive coils being of a size, shape, and pattern and being a distance “

d”

from the metal backing to provide electromagnetic signal amplification for the NFC coil structure and to provide electromagnetic signal shielding for at least one of the plurality of circuit components.

17. The NFC circuit of claim 14 further comprises:

the first through fourth layers being layers of a die of an integrated circuit (IC).

18. The NFC circuit of claim 14 further comprises:

the first layer being a layer of an integrated circuit (IC) package substrate; and

the second through fourth layers being layers of a die of an IC.