FINGER SENSOR INCLUDING CAPACITIVE LENS AND ASSOCIATED METHODS
First Claim
1. A finger sensing device comprising:
- a mounting substrate;
an integrated circuit (IC) die carried by said mounting substrate and comprising an array of electric field-based finger sensing elements;
a plurality of first electrical connections coupling said mounting substrate and said IC die;
a protective plate attached over said array of electric field-based finger sensing elements and having a dielectric constant greater than 5 in all directions and a thickness greater than 40 microns to define a capacitive lens for said array of electric field-based finger sensing elements; and
an encapsulating material adjacent said mounting substrate and said IC die and around at least said plurality of first electrical connections.
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0 Petitions
Accused Products
Abstract
A finger sensing device may include a mounting substrate, an integrated circuit (IC) die carried by the mounting substrate and having an array of electric field-based finger sensing elements, and first electrical connections coupling the mounting substrate and the IC die. In addition, the finger sensing device may include a protective plate attached over the array of electric field-based finger sensing elements and having a dielectric constant greater than 5 in all directions and a thickness greater than 40 microns to define a capacitive lens for the array of electric field-based finger sensing elements. The finger sensing device may also include an encapsulating material adjacent the mounting substrate and the IC die and around at least the first electrical connections.
43 Citations
24 Claims
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1. A finger sensing device comprising:
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a mounting substrate; an integrated circuit (IC) die carried by said mounting substrate and comprising an array of electric field-based finger sensing elements; a plurality of first electrical connections coupling said mounting substrate and said IC die; a protective plate attached over said array of electric field-based finger sensing elements and having a dielectric constant greater than 5 in all directions and a thickness greater than 40 microns to define a capacitive lens for said array of electric field-based finger sensing elements; and an encapsulating material adjacent said mounting substrate and said IC die and around at least said plurality of first electrical connections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A finger sensing device comprising:
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a mounting substrate; an integrated circuit (IC) die carried by said mounting substrate and comprising an array of electric field-based finger sensing elements; a plurality of first electrical connections coupling said mounting substrate and said IC die, said plurality of first electrical connections comprising a plurality of bond wires; a protective plate attached over said array of electric field-based finger sensing elements and having a dielectric constant greater than 5 in all directions and a thickness greater than 40 microns to define a capacitive lens for said array of electric field-based finger sensing elements; an encapsulating material adjacent said mounting substrate and said IC die and around at least said plurality of first electrical connections; at least one electrical conductor carried by said protective plate; and at least one second electrical connection coupling said at least one electrical conductor and said mounting substrate. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A method for making finger sensing device comprising:
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mounting an integrated circuit (IC) die on a mounting substrate and comprising an array of electric field-based finger sensing elements; establishing a plurality of first electrical connections coupling the mounting substrate and the IC die; securing a protective plate over the array of electric field-based finger sensing elements and having a dielectric constant greater than 5 in all directions and a thickness greater than 40 microns to define a capacitive lens for the array of electric field-based finger sensing elements; and forming an encapsulating material adjacent the mounting substrate and the IC die and around at least the plurality of first electrical connections. - View Dependent Claims (19, 20, 21, 22, 23, 24)
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Specification