POWER ELECTRONIC PACKAGE HAVING TWO SUBSTRATES WITH MULTIPLE SEMICONDUCTOR CHIPS AND ELECTRONIC COMPONENTS

• US 20110254177A1
• Filed: 06/29/2011
• Published: 10/20/2011
• Est. Priority Date: 08/29/2006
• Status: Active Grant

• Current Assignee: DENSO Corporation, University of Cambridge, University of Sheffield
• Original Assignee: DENSO Corporation, University of Cambridge, University of Sheffield
• Inventors: RASHID, Jeremy, BUTTAY, Cyril, JOHNSON, C Mark, MALHAN, Rajesh Kumar, UDREA, Florin
• Granted Patent: US 8,432,030 B2
• Time in Patent Office: Days
• US Class Current: 257/782
• CPC Class Codes: H01L 2224/33 of a plurality of layer connectors
• CPC Class Codes: H01L 2224/81894 Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/83894 Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49844 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13062 Junction field-effect transistor [JFET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.

Claims

1. (canceled)

2. A power electronic package comprising:

first and second high thermal conductivity insulating non-planar substrates; and

a plurality of semiconductor chips and electronic components, which are disposed between the first and second high thermal conductivity insulating non-planar substrates, wherein

each of the first and second high thermal conductivity insulating non-planar substrates includes a plurality of electrical insulator layers and patterned electrical conductor layers, which are alternately stacked,

the electrical conductor layers are connected to the electronic components with mechanical and electrical connection,

each of the first and second high thermal conductivity insulating non-planar substrates further includes a plurality of recesses or wells,

the recesses or wells are disposed on predetermined regions of at least one of the first and second high thermal conductivity insulating non-planar substrates, the predetermined regions on which the electronic components are located,

the first and second high thermal conductivity insulating non-planar substrates are mechanically and electrically bonded with a plurality of bonding regions, and

the electrical conductor layers are separated and isolated one another so that a plurality of electric circuits is provided on at least one of the first and second high thermal conductivity insulating non-planar substrates.

3. The power electronic package according to claim 2, wherein

one of the first and second high thermal conductivity insulating non-planar substrates includes a plurality of recesses,

the recesses are disposed on predetermined regions of the one of the first and second high thermal conductivity insulating non-planar substrates, the predetermined regions on which the electronic components are located,

the first and second high thermal conductivity insulating non-planar substrates are mechanically and electrically bonded with a plurality of bonding regions, and

the raised regions or posts provide the bonding regions.

4. The power electronic package according to claim 3, wherein

the first high thermal conductivity insulating non-planar substrate has a planar surface without any recess.

12. The power electronic package according to claim 3, wherein

the bonding regions include a plurality of electrically inactive bonding regions, and

the number of the electrically inactive bonding regions, arrangement of the electrically inactive bonding regions, and a shape of each electrically inactive bonding region are adjusted to have mechanical separation between the first and second high thermal conductivity insulating non-planar substrates.

13. The power electronic package according to claim 3, wherein

each of the first and second high thermal conductivity insulating non-planar substrates further includes a non-bonding region, and

the non bonding region has a height, which is small than that of the bonding regions.

5-11. -11. (canceled)

14-31. -31. (canceled)