ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES

• US 20110255850A1
• Filed: 06/04/2010
• Published: 10/20/2011
• Est. Priority Date: 04/19/2010
• Status: Abandoned Application

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Just, Andrew B., Dimpflmaier, Ronald W., Pyper, Dennis R., Kidd, Douglas P., Malek, Shayan, Weber, Trent, Myers, Scott, Tan, Tang Yew, Sloey, Jason, Dinh, Richard Hung Minh, Jarvis, Daniel W.
• Application Number:
  US12/794,601
• Publication Number:
  US 20110255850A1
• Time in Patent Office: Days
• US Class Current: 396/176
• CPC Class Codes: B32B 17/061 of metal
• CPC Class Codes: B41F 17/00 Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
• CPC Class Codes: G03B 15/03 Combinations of cameras with lighting apparatus; Flash units
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01M 2220/30 Batteries in portable systems, e.g. mobile phone, laptop
• CPC Class Codes: H01M 50/124 having a layered structure
• CPC Class Codes: H01M 50/1245 characterised by the external coating on the casing
• CPC Class Codes: H03F 2200/451 the amplifier being a radio frequency amplifier
• CPC Class Codes: H03F 3/195 in integrated circuits
• CPC Class Codes: H03F 3/213 in integrated circuits
• CPC Class Codes: H04M 1/0277 for a printed circuit board assembly
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0116 : Porous, e.g. foam
• CPC Class Codes: H05K 2201/0162 : Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/056 : Folded around rigid support or component
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10121 : Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10371 : Shields or metal cases
• CPC Class Codes: H05K 2201/10409 : Screws
• CPC Class Codes: H05K 2201/2009 : Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/341 : Surface mounted components
• CPC Class Codes: H05K 3/3447 : Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/363 : by soldering
• CPC Class Codes: H05K 9/0024 : Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
• CPC Class Codes: H05K 9/0032 : having multiple parts, e.g. frames mating with lids
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4911 : including sealing

Abstract

Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.

Claims

1. A connector, comprising:

a metal shell having a plurality of shell sidewalls with interior surfaces; and

a dielectric insert that has a plurality of insert sidewalls that hide the interior surfaces of the shell sidewalls from view.

2. The connector defined in claim 1 wherein the dielectric insert comprises a plastic insert.

3. The connector defined in claim 1 wherein the plurality of shell sidewalls include a top shell sidewall, a bottom shell sidewall, a right shell sidewall, and a left shell sidewall and wherein the plurality of insert sidewalls include a top insert sidewall that at least partly covers the top shell sidewall, a bottom insert sidewall that at least partly covers the bottom shell sidewall, a right insert sidewall that at least partly covers the right shell sidewall, and a left insert sidewall that at least partly covers the left shell sidewall.

4. The connector defined in claim 3 further comprising:

a rear wall with a rear wall opening; and

a moisture indicator that covers the rear wall opening.

5. The connector defined in claim 4 wherein the connector has a connector opening defined by the plurality of insert sidewalls, wherein the rear wall has a visible surface that is visible through the connector opening and has a hidden surface that is hidden from view through the connector opening, and wherein the moisture indicator is attached to the hidden surface and covers the rear wall opening.

6. The connector defined in claim 5 wherein the moisture indicator comprises a wicking layer, a dye layer and at least one moisture barrier layer.

7. The connector defined in claim 1 wherein the dielectric insert has a recess and wherein the metal shell has a protrusion that protrudes into and engages the recess.

8. The connector defined in claim 1 wherein the dielectric insert comprises at least one opening, the connector further comprising:

a metal structure that is electrically shorted to the metal shell and that protrudes through the at least one opening in the dielectric insert.

9. The connector defined in claim 8 further comprising welds that attach the metal structure to the metal shell.

10. The connector defined in claim 9 wherein the metal structure comprises a grounding plate adapted to connect to ground structures in mating plugs.

11. Apparatus, comprising:

a radio-frequency shielding can having a first opening;

an electrical component having a second opening that overlaps with the first opening;

a mounting structure that is received in both the first and second openings; and

a substrate to which the mounting structure mounts the radio-frequency shielding can and the electrical component.

12. The apparatus defined in claim 11 wherein the mounting structure comprises mating fasteners.

13. The apparatus defined in claim 12 wherein the mating fasteners comprise a male fastener and a female fastener.

14. The apparatus defined in claim 13 wherein the male fastener has a threaded shaft and wherein the female fastener has a threaded bore.

15. The apparatus defined in claim 14 wherein the female fastener is mounted to the substrate.

16. The apparatus defined in claim 15 wherein the radio-frequency shielding can has a frame and a lid and wherein the first opening is formed in the frame.

17. The apparatus defined in claim 16 wherein the electrical component comprises a speaker.

18. The apparatus defined in claim 11 wherein the mounting structure comprises first and second mating fasteners, wherein the second fastener is soldered to the substrate, and wherein the first fastener is screwed into the second fastener.

19. The apparatus defined in claim 18 wherein the substrate comprises a printed circuit board with a solder pad and wherein the second fastener is soldered to the substrate at the solder pad.

20. The apparatus defined in claim 19 wherein the solder pad comprises a ring-shaped metal structure and wherein the printed circuit board comprises multiple layers of ring-shaped metal below the solder pad.

21. The apparatus defined in claim 11 wherein the radio-frequency shielding can blocks radio-frequency signals at a wavelength associated with operating circuitry within the radio-frequency shielding can, wherein the mounting structure and other portions of the radio-frequency shielding can are attached to the substrate at a plurality of respective attachment points and wherein no two adjacent attachment points among the attachment points are separated by more than a quarter of the wavelength.

22. The apparatus defined in claim 11 wherein the substrate comprises a printed circuit board having a thickness, wherein the mounting structure comprises a first fastener and a second fastener, and wherein the second fastener is soldered to the printed circuit board without passing through the thickness of the printed circuit board.

23. Apparatus, comprising:

a heat sink structure;

a camera module mounted to the heat sink structure; and

a flash unit mounted to the heat sink structure.

24. The apparatus defined in claim 23 wherein the heat sink structure comprises a first hole through which light for the camera module passes and a second hole through which light from the flash unit passes.

25. The apparatus defined in claim 24 further comprising a cover glass having a black ink layer with an opening through which the light from the flash unit passes.

26. The apparatus defined in claim 25 wherein the flash unit comprises a light-emitting diode that is attached to the heat sink structure with adhesive.

27. Shielded circuitry, comprising:

a substrate;

a plurality of electrical components mounted on the substrate;

a radio-frequency shield that is attached to the substrate and that covers the plurality of electrical components, wherein a cavity is formed between an inner surface of the radio-frequency shield and the electrical components and portions of the substrate; and

thermally conductive filler that substantially fills the cavity.

28. The shielded circuitry defined in claim 27 wherein the electrical components have surfaces at different heights above the substrate that form surface irregularities and wherein the thermally conductive filler conforms to the surface irregularities.

29. The shielded circuitry defined in claim 27 wherein the substrate comprises a printed circuit board.

30. The shielded circuitry defined in claim 27 wherein the electrical components include an integrated circuit.

31. The shielded circuitry defined in claim 27 wherein the electrical components comprises radio-frequency integrated circuits.

32. The shielded circuitry defined in claim 27 wherein the electrical components include at least one radio-frequency power amplifier.

33. The shielded circuitry defined in claim 27 wherein the thermally conductive filler comprises silicone.

34. The shielded circuitry defined in claim 27 wherein the thermally conductive filler comprises an elastomeric material containing particles of ceramic.

35. The shielded circuitry defined in claim 27 wherein the thermally conductive filler comprises an elastomeric material containing particles of material.

36. The shielded circuitry defined in claim 27 wherein the radio-frequency shield comprises a metal radio-frequency shield can lid.