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PLASMA ACTIVATED CONFORMAL FILM DEPOSITION

  • US 20110256726A1
  • Filed: 04/11/2011
  • Published: 10/20/2011
  • Est. Priority Date: 04/15/2010
  • Status: Active Grant
First Claim
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1. A method of depositing a film on a substrate surface, the method comprising:

  • (a) providing a substrate in a reaction chamber;

    (b) introducing a first reactant in vapor phase into the reaction chamber under conditions allowing the first reactant to adsorb onto the substrate surface;

    (c) introducing a second reactant in vapor phase into the reaction chamber while the first reactant is adsorbed on the substrate surface, wherein the second reactant is introduced without first sweeping the first reactant out of the reaction chamber; and

    (d) exposing the substrate surface to plasma to drive a reaction between the first and second reactants on the substrate surface to form the film.

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