PACKAGING STRUCTURE AND PROCESS OF SOLAR CELL

• US 20110259411A1
• Filed: 04/26/2010
• Published: 10/27/2011
• Est. Priority Date: 04/26/2010
• Status: Abandoned Application

• Current Assignee: Solapoint Corp.
• Original Assignee: Solapoint Corp.
• Inventors: LIU, Tai Hui
• Application Number:
  US12/767,333
• Publication Number:
  US 20110259411A1
• Time in Patent Office: Days
• US Class Current: 136/256
• CPC Class Codes: H01L 31/02013 comprising output lead wires elements
• CPC Class Codes: H01L 31/022425 for solar cells
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

A packaging structure and process of solar cell is disclosed. The packaging structure of solar cell comprises two conductive films and two surface electrodes disposed on a photovoltaic cell (PV cell), wherein two conductive films are respectively electrically coupled with the surface electrodes via a plurality of solder balls.

Claims

1. A packaging structure of a solar cell, comprising:

two surface electrodes, disposed on a PV (photovoltaic) cell; and

two conductive films, respectively electrically coupled with said surface electrodes via a plurality of solder balls.

2. A packaging structure of a solar cell according to claim 1, wherein said two surface electrodes are respectively located on the opposite sides of the window layer of said PV cell, wherein one end of each conductive film is electrically coupled with one corresponding electrode, and the other end extends outside the window layer to expose said window layer.

3. A packaging structure of a solar cell according to claim 2, further comprising a substrate, and said PV cell is disposed on said substrate, wherein said window layer and said substrate are respectively located at the upper and lower surfaces of said PV cell, and the other end of each conductive film is electrically coupled with said substrate.

4. A packaging structure of a solar cell according to claim 1, further comprising a barrier layer between said solder balls and said surface electrodes to prevent said solder balls penetrating said surface electrodes, wherein said surface electrodes or said conductive films independently comprise one or any combination selected from the group consisting of Ni, Ag, Al, Cu, Pd.

5. A packaging structure of a solar cell according to claim 1, wherein the diameter of said solder balls ranges from about 100 to 150 μ

m, and the pitch between said solder balls is about 200 μ

m.

6. A packaging process of a solar cell, comprising the following steps:

disposing a plurality of solder balls on two surface electrodes of a PV (photovoltaic) cell, wherein said PV cell is disposed on a substrate; and

hot laminating at least one conductive film and said surface electrodes by said plurality of solder balls.

7. A packaging process of a solar cell according to claim 6, further comprising the following step:

removing part of said conductive film covering said window layer of said PV cell to form two conductive films, wherein one end of each conductive film is electrically coupled with one corresponding surface electrode, and the other end extends outside the window layer to expose said window layer.

8. A packaging process of a solar cell according to claim 7, further comprising the following step:

connecting respectively two ends of said conductive film to said substrate simultaneously when said conductive film and said surface electrodes are hot laminated, wherein said window layer and said substrate are respectively located at the upper and lower surfaces of said PV cell.

9. A packaging process of a solar cell according to claim 7, further comprising the following step:

connecting respectively two ends of said conductive film to said substrate after said conductive film and said surface electrodes are hot laminated, wherein said window layer and said substrate are respectively located at the upper and lower surfaces of said PV cell.

10. A packaging process of a solar cell according to claim 7, further comprising the following step:

connecting respectively two ends of said conductive film to said substrate simultaneously when said part of said conductive film is removed, wherein said window layer and said substrate are respectively located at the upper and lower surfaces of said PV cell.

11. A packaging process of a solar cell according to claim 7, further comprising the following step:

connecting respectively two ends of said conductive film to said substrate after said part of said conductive film is removed, wherein said window layer and said substrate are respectively located at the upper and lower surfaces of said PV cell.

12. A packaging process of a solar cell according to claim 6, further comprising the following step:

forming a barrier layer on said surface electrodes before said solder balls are disposed on said surface electrodes.

13. A packaging process of a solar cell according to claim 6, wherein said solder balls could be disposed by BGA (Ball Grid Array) method, wherein the diameter of said solder balls ranges from about 100 to 150 μ

m, and the pitch between said solder balls is about 200 μ

m.

14. A packaging process of a solar cell according to claim 6, wherein said surface electrodes comprise one or any combination selected from the group consisting of Ni, Ag, Al, Cu, Pd, and said conductive films comprise one or the combination selected from the group consisting of Ni, Ag, Al, Cu, Pd.