IMAGE ACQUISITION SYSTEM AND METHOD FOR THE MANUFACTURE THEREOF

• US 20110260035A1
• Filed: 01/26/2007
• Published: 10/27/2011
• Est. Priority Date: 03/28/2006
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Seger, Ulrich, Franz, Gerald
• Granted Patent: US 9,742,968 B2
• Time in Patent Office: Days
• US Class Current: 250/208.1
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

An image acquisition system, in particular for automotive applications, includes: a substrate; an image sensor mounted on the substrate and contacted via contact points; an optically transparent sealing compound that covers the image sensor, the contact points, and a portion of the upper substrate side; an optical device being arranged or secured in or on the sealing compound. The optical device can be placed into the sealing compound after shaping of the sealing compound or directly. Furthermore, the optical device can also be arranged directly by shaping the sealing compound. Manufacture of the image acquisition system can be incorporated into a board populating process.

Claims

1-19. -19. (canceled)

20. An image acquisition system, comprising:

a substrate;

an image sensor mounted on the substrate and contacted via contact points;

an optically transparent sealing compound that covers the image sensor, the contact points, and a portion of an upper substrate side; and

an optical device at least one of (a) arranged and (b) secured at least one of (a) in and (b) on the sealing compound.

21. The image acquisition system according to claim 20, wherein the image acquisition system is adapted for an automobile application.

22. The image acquisition system according to claim 20, wherein the optical device includes at least one of (a) a lens element and (b) a lens element system.

23. The image acquisition system according to claim 20, wherein the optical device is adapted to focus incident light onto the image sensor.

24. The image acquisition system according to claim 20, wherein the optical device is secured in the sealing compound.

25. The image acquisition system according to claim 24, wherein a receptacle in which the optical device is adhesively bonded is arranged in the sealing compound.

26. The image acquisition system according to claim 24, wherein the optical device is pressed into the sealing compound and positively held thereby.

27. The image acquisition system according to claim 20, wherein the optical device is arranged as part of the sealing compound.

28. The image acquisition system according to claim 27, wherein the surface of the sealing compound has a region that forms at least one of (a) the optical device and (b) a portion of the optical device.

29. The image acquisition system according to claim 20, wherein the image sensor is completely encapsulated on the substrate.

30. The image acquisition system according to claim 20, wherein the sealing compound is delimited by a delimiter mounted on the substrate.

31. A method for manufacturing an image acquisition system, comprising:

securing and contacting at least one image sensor on a substrate;

applying an optically transparent sealing compound onto the substrate such that it covers the image sensor and its contact points; and

at least one of (a) arranged and (b) mounting an optical device at least one of (a) on and (b) in the sealing compound.

32. The method according to claim 31, wherein a receiving depression in which the optical device is subsequently secured is arranged in the sealing compound.

33. The method according to claim 32, wherein the receiving depression is form by impression by a punch in an uncured sealing compound.

34. The method according to claim 31, wherein the optical device is pressed into an as-yet-uncured sealing compound.

35. The method according to claim 31, wherein a region of the surface of the sealing compound is arranged as an optical device.

36. The method according to claim 31, wherein at least one of (a) the arranging and (b) the mounting of the optical device includes a populating method for populating the substrate.

37. The method according to claim 36, wherein real-time focusing of the image sensor is accomplished in the populating method.

38. The method according to claim 37, wherein upon at least one of (a) adhesive bonding and (b) placement into the sealing compound, the optical device is held, until at least one of (a) an adhesive material and (b) the sealing compound that immobilizes it has cured, in a best-focus position in which an image plane is located on the image sensor.

39. The method according to claim 38, wherein during a curing operation of at least one of (a) the adhesive material and (b) the sealing compound, at least one of (a) light and (b) radiation is radiated along an optical axis onto the optical device, and a measured signal of the image sensor is evaluated, the position of the optical device being modified as applicable.