PATCH ANTENNA AND METHOD OF MAKING PATCH ANTENNA

• US 20110260928A1
• Filed: 04/20/2011
• Published: 10/27/2011
• Est. Priority Date: 04/27/2010
• Status: Abandoned Application

• Current Assignee: Mitsumi Electric Co., Ltd. (Minebea Mitsumi, Inc.)
• Original Assignee: Mitsumi Electric Co., Ltd. (Minebea Mitsumi, Inc.)
• Inventors: Ito, Tsutomu, Noro, Junichi, Shimizu, Kouzo
• Application Number:
  US13/090,374
• Publication Number:
  US 20110260928A1
• Time in Patent Office: Days
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/045 with particular feeding means for circular polarisation H01Q9/0428
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

A patch antenna can prevent a feed point (solder) from rising upward beyond the main surface of an antenna radiation electrode, and a method of making that patch antenna. A dielectric base plate (12A) has, on its top surface (12u) side, a recess (12c) that is provided in the periphery of a base plate through-hole (12a). This recess (12c) is able to accommodate a head (181) of a feed pin (18) and solder (15A), and also has a depth that is greater than the height of the head (181) of the feed pin (18). The antenna radiation electrode (14A) is formed on inner wall surfaces (12c-1) defining the recess (12c). In a state in which the head (181) of the feed pin (18) is accommodated in the recess (12c), solder (15A) is placed not to project upward beyond the main surface of the antenna radiation electrode (14A).

Claims

1. A patch antenna comprising:

a dielectric base plate having a top surface and a bottom surface facing each other, and having a base plate through-hole penetrating from the top surface to the bottom surface at a predetermined location;

an antenna radiation electrode formed on the top surface of the dielectric base plate;

a ground electrode formed on the bottom surface of the dielectric base plate and having a ground opening, said ground opening being substantially concentric with the base plate through-hole and having a diameter greater than that of the base plate through-hole; and

a feed pin having a head provided on an upper end thereof and a bar-shaped body extending from the upper end to a lower end thereof, said head being connected to the antenna radiation electrode with solder at the predetermined location, said lower end being derived toward the bottom surface of the dielectric base plate via the base plate through-hole and the ground opening,

wherein the dielectric base plate has a recess provided in a periphery of the base plate through-hole on a side of the top surface for accommodating the head and the solder, said recess having a depth greater than a height of the head;

the antenna radiation electrode is formed on an inner wall surface of the recess; and

the solder is placed below a main surface of the antenna radiation electrode in a state that the head is accommodated in the recess.

2. The patch antenna according to claim 1, wherein the recess has the inner wall surface including a bottom surface with the head placed thereon and an inclined surface having a diameter increasing from the bottom surface toward the top surface of the dielectric base plate, said inner wall surface substantially having a shape of a mortar.

3. The patch antenna according to claim 2, wherein the recess includes he bottom surface having a diameter greater than that of the head, and the solder is placed only on the bottom surface.

4. The patch antenna according to claim 3, wherein the solder is placed on an area except a topmost surface of the head.

5. The patch antenna according to claim 4, wherein the solder includes solder parts in a number of N, N being an integer of two or more, said solder parts being arranged apart from each other with a space in between in a rotational symmetry pattern with respect to a center line of the base plate through-hole.

6. The patch antenna according to claim 1, wherein the dielectric base plate substantially has a cuboid shape.

7. The patch antenna according to claim 1, wherein the dielectric base plate is formed of a ceramic material.

8. The patch antenna according to claim 1, wherein the antenna radiation electrode is formed of a silver paste coated through screen printing on the top surface of the dielectric base plate, and is formed of a silver paste formed through pad printing on the inner wall surface of the recess.

9. The patch antenna according to claim 1, wherein the antenna radiation electrode substantially has a square shape.

10. The patch antenna according to claim 1, wherein the patch antenna is a global positioning system antenna to receives an electric wave from a global positioning system satellite.

11. The patch antenna according to claim 1, wherein the patch antenna is a satellite digital audio radio service antenna to receive an electric wave from a satellite digital audio radio service satellite.

12. A method of producing a patch antenna through soldering a feed pin to a dielectric base plate, said feed pin having a head that provided on an upper end thereof and a bar-shaped body extending from the upper end to a lower end thereof, the method comprising the steps of:

preparing the dielectric base plate having a top surface and a bottom surface facing each other, and having a base plate through-hole penetrating from the top surface to the bottom surface at a predetermined location, said dielectric base plate further including a recess in a periphery of the base plate through-hole on a side of the top surface for accommodating a head of the feed pin, said recess having a depth greater than a height of the head;

forming a ground electrode on the bottom surface of the dielectric base plate, said ground electrode having a ground opening substantially concentric with the base plate through-hole and having a diameter greater than that of the base plate through-hole;

forming an antenna radiation electrode on the top surface of the dielectric base plate and an inner wall surface of the recess;

placing a solder paste on the antenna radiation electrode at a location where the head is placed;

pushing the body in the base plate through-hole from the top surface of the dielectric base plate so that the lower end is derived toward the bottom surface of the dielectric base plate and the head is placed on the solder paste; and

melting the solder paste through reflow to solder the feed pin.

13. The method according to claim 12, wherein the step of forming the antenna radiation electrode includes applying a silver paste on the top surface of the dielectric base plate through screen printing, and applying the silver paste on the inner wall surface of the recess through pad printing.

14. The method according to claim 13, wherein the step of preparing the dielectric base plate includes forming the recess to have the inner wall surface including a bottom surface with the head placed thereon and an inclined surface having a diameter increasing from the bottom surface toward the top surface of the dielectric base plate.

15. The method according to claim 14, wherein the step of placing the solder paste includes applying the solder paste in a donut shape on the antenna radiation electrode.

16. The method according to claim 14, wherein the step of placing the solder paste includes placing the solder paste in a ring shape on the antenna radiation electrode.

17. The method according to claim 14, wherein the step of placing the solder paste includes applying solder parts in a number of N, N being an integer of two or more, on the antenna radiation electrode, said solder parts being arranged apart from each other with a space in between in a rotational symmetry pattern with respect to a center line of the base plate through-hole.