POLISHING SOLUTION DISTRIBUTION APPARATUS AND POLISHING APPARATUS HAVING THE SAME

• US 20110263183A1
• Filed: 04/11/2011
• Published: 10/27/2011
• Est. Priority Date: 04/26/2010
• Status: Active Grant

• Current Assignee: Sumco Corporation
• Original Assignee: Sumco Corporation
• Inventors: HASHII, Tomohiro, KUROSAWA, Yoshiaki, KAKIZONO, Yuichi
• Granted Patent: US 9,017,145 B2
• Time in Patent Office: Days
• US Class Current: 451/64
• CPC Class Codes: B24B 37/08 for double side lapping
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.

Claims

1. A polishing solution distribution apparatus comprising:

a branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed;

a support portion to support the branch body; and

a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.

2. The polishing solution distribution apparatus according to claim 1,

wherein the plural flow passages have the same inclination in the flow direction thereof while being connected to the side face at the same height position.

3. The polishing solution distribution apparatus according to claim 1,

wherein a supply portion of polishing solution is arranged above the solution pan and the supply portion supplies polishing solution to the solution pan by dropping polishing solution.

4. The polishing solution distribution apparatus according to claim 1,

wherein a deadweight to set a height position of the gravity center of the branch body to be lower than a supported height position of the branch body by the universal joint mechanism is attached to the branch body.

5. The polishing solution distribution apparatus according to claim 1,

further comprising plural branch piping formed flexibly being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being respectively connected to delivery ports of the plural flow passages.

6. The polishing solution distribution apparatus according to claim 2,

further comprising plural branch piping formed flexibly being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being respectively connected to delivery ports of the plural flow passages.

7. The polishing solution distribution apparatus according to claim 3,

further comprising plural branch piping formed flexibly being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being respectively connected to delivery ports of the plural flow passages.

8. The polishing solution distribution apparatus according to claim 4,

further comprising plural branch piping formed flexibly being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being respectively connected to delivery ports of the plural flow passages.

9. The polishing solution distribution apparatus according to claim 1,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the delivery port having an opening portion directed upward.

10. The polishing solution distribution apparatus according to claim 2,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the delivery port having an opening portion directed upward.

11. The polishing solution distribution apparatus according to claim 3,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the delivery port having an opening portion directed upward.

12. The polishing solution distribution apparatus according to claim 4,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the delivery port having an opening portion directed upward.

13. The polishing solution distribution apparatus according to claim 5,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the branch piping having an opening portion directed upward.

14. The polishing solution distribution apparatus according to claim 6,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the branch piping having an opening portion directed upward.

15. The polishing solution distribution apparatus according to claim 7,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the branch piping having an opening portion directed upward.

16. The polishing solution distribution apparatus according to claim 8,

further comprising a funnel being capable of supplying polishing solution to a predetermined position of a polishing mechanism to perform polishing of a polishing object as being arranged below the branch piping having an opening portion directed upward.

17. A polishing apparatus comprising the polishing solution distribution apparatus according to claim 1.