System on a Chip Using Integrated MEMS and CMOS Devices
First Claim
Patent Images
1. A system comprising:
- a semiconductor substrate;
at least one CMOS device overlying the semiconductor substrate, the CMOS device being configured to provide a logic array and a memory array;
a surface region overlying the CMOS device, the surface region forming an interface region;
at least a first micro electrical mechanical system (MEMS) configured in a first region overlying a first portion of the interface region, wherein the first MEMS is configured to sense first physical perturbations; and
a second MEMS configured in a second region overlying a second portion of the interface region, wherein the second MEMS is configured to sense second physical perturbations, the first physical perturbations being different from the second physical perturbations.
9 Assignments
0 Petitions
Accused Products
Abstract
An integrated MEMS system in which CMOS and MEMS devices are provided to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured.
-
Citations
36 Claims
-
1. A system comprising:
-
a semiconductor substrate; at least one CMOS device overlying the semiconductor substrate, the CMOS device being configured to provide a logic array and a memory array; a surface region overlying the CMOS device, the surface region forming an interface region; at least a first micro electrical mechanical system (MEMS) configured in a first region overlying a first portion of the interface region, wherein the first MEMS is configured to sense first physical perturbations; and a second MEMS configured in a second region overlying a second portion of the interface region, wherein the second MEMS is configured to sense second physical perturbations, the first physical perturbations being different from the second physical perturbations. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
-
-
28. A method for fabricating a semiconductor device comprising:
-
receiving a semiconductor substrate; forming one or more CMOS devices upon the semiconductor substrate; forming an interface layer on top of the one or more CMOS devices; and forming one or more MEMS physical sensors upon the interface layer using a foundry compatible process. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36)
-
Specification