FILM DEPOSITION DEVICE AND SUBSTRATE PROCESSING DEVICE

• US 20110265725A1
• Filed: 09/25/2009
• Published: 11/03/2011
• Est. Priority Date: 09/26/2008
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Moroi, Masayuki, Tsuji, Norihiko, Yanagitani, Kenichi, Hanada, Yoshiyuki
• Application Number:
  US13/120,681
• Publication Number:
  US 20110265725A1
• Time in Patent Office: Days
• US Class Current: 118/725
• CPC Class Codes: C23C 16/0245 by etching with a plasma
• CPC Class Codes: C23C 16/45551 for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
• CPC Class Codes: C23C 16/4583 the substrate being supported substantially horizontally
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating
• CPC Class Codes: H01L 21/67005 Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67346 characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
• CPC Class Codes: H01L 21/67706 Mechanical details, e.g. roller, belt H01L21/67709 takes precedence

Abstract

A film deposition device includes a substrate transporting device arranged in a vacuum chamber to include a circulatory transport path in which substrate mounting parts arranged in a row are transported in a circulatory manner, the circulatory transport path including a linear transport path in which the substrate mounting parts are transported linearly. A first reactive gas supplying part is arranged along a transporting direction in which the substrate mounting parts are transported in the linear transport path, to supply a first reactive gas to the substrate mounting parts. A second reactive gas supplying part is arranged alternately with the first reactive gas supplying part along the transporting direction, to supply a second reactive gas to the substrate mounting parts. A separation gas supplying part is arranged to supply a separation gas to a space between the first reactive gas supplying part and the second reactive gas supplying part.

Claims

1. A film deposition device in which at least two mutually reactive gases are sequentially supplied to a surface of a substrate in a vacuum chamber and the gas supplying cycle is repeated a number of times, so that a plurality of resultant layers are laminated on the substrate surface to form a thin film thereon, the film deposition device comprising:

a substrate transporting device arranged in the vacuum chamber to include a circulatory transport path in which a plurality of substrate mounting parts arranged in a row are transported in a circulatory manner, the circulatory transport path including a linear transport path in which the plurality of substrate mounting parts are transported linearly;

a first reactive gas supplying part arranged. along a transporting direction in which the plurality of substrate mounting parts are transported in the linear transport path, to supply a first reactive gas to the plurality of substrate mounting parts which are transported in the linear transport path;

a second reactive gas supplying part arranged alternately with the first reactive gas supplying part along the transporting direction, to supply a second reactive gas to the plurality of substrate mounting parts which are transported in the linear transport path;

a separation gas supplying part arranged to supply a separation gas to a space between the first reactive gas supplying part and the second reactive gas supplying part, to separate a first region to which the first reactive gas is supplied from a second region to which the second reactive gas is supplied;

an exhaust part arranged to exhaust the gases inside the vacuum chamber;

a heating part arranged to heat a substrate on each of the plurality of substrate mounting parts;

a substrate inlet part arranged on an upstream side of the linear transport path in the transporting direction so that a substrate is delivered by each of the plurality of the substrate mounting parts; and

a substrate outlet part arranged on a downstream side of the linear transport path in the transporting direction so that a substrate from each of the plurality of substrate mounting parts is received through the substrate outlet part.

2. The film deposition device according to claim 1, wherein the substrate transporting device includes a pair of transmission belts which are wound between a pair of rotors whose rotating shafts are parallel to each other, to form the circulatory transport path.

3. The film deposition device according to claim 2, further comprising a motor for making at least one side of a pair of the rotors rotate in order to carry out circulatory movement of the pair of transmission belts.

4. The film deposition device according to claim 2, wherein the plurality of substrate mounting parts are arranged in the pair of transmission belts.

5. The film deposition device according to claim 1, wherein the vacuum chamber includes an exhaust port for exhausting gas from a space between adjacent separation gas supplying regions in the separation gas supplying part.

6. The film deposition device according to claim 5, wherein the exhaust port is disposed above the linear transport path.

7. The film deposition device according to claim 1, wherein the circulatory transport path is arranged around a horizontal rotating shaft in a vertical direction.

8. The film deposition device according to claim 1, wherein the circulatory transport path is arranged around a vertical rotating shaft in a horizontal direction.

9. The film deposition device according to claim 1, wherein a preheating region for preheating a substrate is arranged in the circulatory transport path between the substrate inlet part and the region where the first reactive gas supplying part, the second reactive gas supplying part, and the separation gas supplying part are arranged.

10. The film deposition device according to claim 1, further comprising a control part which outputs a control signal to an external substrate delivery unit so that the external substrate delivery unit delivers a substrate to one of the moving substrate mounting parts in the substrate inlet part, the control part outputting a control signal to an external substrate receiving unit so that the external substrate receiving unit receives a substrate from another of the moving substrate mounting parts in the substrate outlet part.

11. The film deposition device according to claim 1, wherein each of the first reactive gas supplying part and the second reactive gas supplying part contains a gas nozzle which is disposed to perpendicularly intersect the linear transport path.

12. The film deposition device according to claim 1, further comprising a cleaning process part which supplies a cleaning gas to the substrate mounting part which is moved to the substrate inlet part from the substrate outlet part in the substrate transporting device in order to perform a cleaning process for the substrate mounting part transported by the substrate transporting device.

13. A substrate processing device comprising:

a vacuum transport chamber which contains a substrate transporting device inside the vacuum transport chamber;

the film deposition device according to claim 1 which is airtightly connected to the vacuum transport chamber; and

a load lock chamber which is airtightly connected to the vacuum transport chamber and arranged so that an internal pressure of the load lock chamber is switchable between a vacuum pressure and an atmospheric pressure.