MANUFACTURING ELECTROCHEMICAL SENSOR MODULE

• US 20110265944A1
• Filed: 11/12/2009
• Published: 11/03/2011
• Est. Priority Date: 11/14/2008
• Status: Active Grant

• Current Assignee: Pepex Biomedical, Inc.
• Original Assignee: Pepex Biomedical, LLC
• Inventors: Say, James L.
• Granted Patent: US 8,506,740 B2
• Time in Patent Office: Days
• US Class Current: 156/227
• CPC Class Codes: G01N 27/403 Cells and electrode assemblies
• CPC Class Codes: Y10T 156/1015 Folding
• CPC Class Codes: Y10T 156/102 with deformation or cutting of corrugated lamina
• CPC Class Codes: Y10T 156/1051 by folding

Abstract

Certain processes for manufacturing an electrochemical sensor module include molding first and second opposing portions of a sensor module housing onto a carrier; installing an electrode arrangement on the first portion of the sensor module housing; folding the carrier to align the first portion of the sensor module housing with the second portion; and joining the first and second portions of the sensor module housing. The carrier can be advanced amongst different stations that perform the various process steps.

Claims

1. A method of manufacturing an electrochemical sensor module, the method comprising:

molding first and second opposing portions of a sensor module housing onto a carrier, the first portion including a depression that at least partially forms an analysis cell when the first portion is aligned with the second portion;

installing an electrode arrangement on the first portion of the sensor module housing at an installation station, wherein the electrode arrangement is arranged in fluid communication with the analysis cell when the first portion is aligned with the second portion;

folding the carrier to align the first portion of the sensor module housing with the second portion at a folding station; and

joining the first and second portions of the sensor module housing at a joining station.

2. The method of claim 1, further comprising advancing the carrier between the stations.

3. The method of claim 1, wherein molding first and second opposing portions of the sensor module housing comprises injection molding the first and second opposing portions.

4. The method of claim 1, wherein molding first and second opposing portions of the sensor module housing comprises molding at least the first portion to define a channel extending from the depression to an exterior of the first portion, wherein the channel at least partially defines a passageway leading to the analysis cell when the first portion is aligned with the second portion.

5. The method of claim 1, wherein installing the electrode arrangement comprises installing at least one continuous monofilament to the first portion of the senor module housing.

6. The method of claim 1, wherein installing the electrode arrangement comprises unwinding the electrode arrangement from at least a first reel.

7. The method of claim 1, wherein folding the carrier comprises breaking the carrier along a fold axis.

8. The method of claim 1, wherein joining the first and second portions includes welding together the first and second portions.