LED PACKAGE

• US 20110266574A1
• Filed: 01/17/2011
• Published: 11/03/2011
• Est. Priority Date: 04/29/2010
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: LIN, CHIH-YUNG, HSIEH, MIN-TSUN, YEH, CHING-LIEN, TSENG, WEN-LIANG, LIAO, CHI-WEI
• Application Number:
  US13/007,677
• Publication Number:
  US 20110266574A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.

Claims

1. An LED package comprising:

a substrate;

an LED die arranged on the substrate; and

an encapsulating layer covering the LED die, wherein the encapsulating layer further comprises a light dispersing element with a light scattering intensity in proportional to a light intensity of light generated by the LED die and illuminated on the encapsulating layer.

2. The LED package of claim 1, wherein the light dispersing element is an atomization layer or a sandblasting layer on an surface of the encapsulating layer.

3. The LED package of claim 2, wherein a density of atomization of the atomization layer or micro-recesses of the sandblasting layer decreases from a center to a periphery of the encapsulating layer.

4. The LED package of claim 1, wherein the light dispersing element includes light scattering particles in the encapsulating layer.

5. The LED package of claim 4, wherein a density of the light scattering particles decreases from a center to a periphery of the encapsulating layer.

6. The LED package of claim 1, wherein the encapsulating layer includes luminescent material with a space between the luminescent material and the LED die.

7. The LED package of claim 6, wherein the luminescent material is at an outer surface, an inner surface, or an inside of the encapsulating layer.

8. The LED package of claim 6, wherein the luminescent material is garnet compound, silicate, sulfide, phosphate, nitride, oxynitride, or SiAlON.

9. The LED package of claim 1, wherein a density of the luminescent material is proportional to the light intensity of light generated by the LED die and illuminated on the encapsulating layer.

10. The LED package of claim 9, wherein the density of the luminescent material decrease from a center to a periphery of the encapsulating layer.

11. An LED package comprising:

a substrate;

an LED die arranged on the substrate; and

an encapsulating layer with luminescent material covering the LED die, wherein the encapsulating layer further comprises a light dispersing element with a light scattering intensity and luminescent material density in proportional to a light intensity of light generated by the LED die and illuminated on the encapsulating layer.

12. The LED package of claim 11, wherein the encapsulating layer has a configuration of a hollow hemisphere.

13. The LED package of claim 11, wherein the encapsulating layer has a configuration of a solid hemisphere.