INTEGRATED-CIRCUIT ATTACHMENT STRUCTURE WITH SOLDER BALLS AND PINS

• US 20110266672A1
• Filed: 01/30/2009
• Published: 11/03/2011
• Est. Priority Date: 01/30/2009
• Status: Abandoned Application

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Sylvester, Jeffrey Scott
• Application Number:
  US13/142,469
• Publication Number:
  US 20110266672A1
• Time in Patent Office: Days
• US Class Current: 257/738
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01061 Promethium [Pm]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H05K 2201/10659 Different types of terminals for the same component, e.g. solder balls combined with leads
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An integrated-circuit attachment structure comprises an integrated circuit and a package assembly. The package assembly includes a package containing the integrated circuit. The package has pins at its corners and a grid at least primarily of solder halls on its bottom face.

Claims

1. An integrated-circuit attachment:

structure comprising;

an integrated circuit;

a package assembly including a package containing said integrated circuit, said package having a bottom face, said bottom face having corners, said package including a grid at least primarily of solder balls at said face, said package assembly including pins at said corners.

2. An integrated-circuit attachment structure as recited in claim 1 wherein said pins are straight pins.

3. An integrated-circuit attachment structure as recited in claim 2 wherein said pins are attached to said package.

4. An integrated-circuit package as recited in claim 3 further comprising a circuit board having through holes into which said straight pins are inserted and soldered.

5. An integrated-circuit package as recited in claim 4 wherein at least one of said pins provides for transferring power or signals between said integrated circuit and said circuit board.

6. An integrated-circuit attachment structure as recited in claim 2 wherein said straight pins number exactly four.

7. An integrated-circuit attachment structure as recited in claim 1 wherein said pins are gull-wing type pins attached to said. package.

8. An integrated-circuit attachment structure as recited in claim 7 further comprising a circuit board having plural layers including a top layer and other layers, said top layer having bonding pads, said solder balls being soldered to at least some of said bonding pads, said pins being soldered to others of said bonding pads.

9. An integrated-circuit attachment structure as recited, in claim 1 wherein said package assembly also includes a bracket for mounting on said package, said bracket including said pins.

10. An integrated-circuit attachment structure as recited in claim 7 further comprising a circuit board, said circuit board having through holes into which said straight pins are inserted and soldered so that said bracket is attached to said package,

11. An integrated-circuit attachment method comprising:

obtaining or forming an integrated-circuit package assembly having a grid of solder balls and pins;

soldering said balls and pins to a circuit board.

12. An integrated-circuit attachment method as recited in claim 11 further comprising transferring power or signals between said, integrated-circuit package and said printed-circuit board through at least one of said pins.

13. An integrated-circuit attachment method as recited in claim 11 further comprising transferring power or signals between said integrated-circuit package and said printed-circuit board through said bails but not through said pins.

14. An integrated-circuit attachment method as recited in claim 11 wherein said soldering involves soldering said pins into holes in said circuit board

15. An integrated-circuit attachment method as recited in claim 11 wherein said soldering involves soldering said pins onto surface-mount pads on said printed-circuit board.