TEST CIRCUIT OF AN INTEGRATED CIRCUIT ON A WAFER
First Claim
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1. A testing device, comprising:
- a first test antenna configured to form a wirelessly loopback connection with a first embedded antenna of a semiconductor wafer to facilitate testing of the first embedded antenna by transforming an electromagnetic signal between the first test antenna and the first embedded antenna into an electrical signal; and
a second test antenna configured to form a wirelessly loopback connection with a second embedded antenna of the semiconductor wafer to facilitate testing of the second embedded antenna by transforming an electromagnetic signal between the second test antenna and the second embedded antenna.
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Abstract
A test circuit is described of a circuit integrated on wafer of the type comprising at least one antenna of the embedded type comprising at least one test antenna associated with said at least one embedded antenna that realizes its connection of the wireless loopback type creating a wireless channel for said at least one embedded antenna and allows its electric test, transforming an electromagnetic signal of communication between said at least one embedded antenna and said at least one test antenna into an electric signal that can be read by a test apparatus.
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Citations
38 Claims
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1. A testing device, comprising:
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a first test antenna configured to form a wirelessly loopback connection with a first embedded antenna of a semiconductor wafer to facilitate testing of the first embedded antenna by transforming an electromagnetic signal between the first test antenna and the first embedded antenna into an electrical signal; and a second test antenna configured to form a wirelessly loopback connection with a second embedded antenna of the semiconductor wafer to facilitate testing of the second embedded antenna by transforming an electromagnetic signal between the second test antenna and the second embedded antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. An integrated circuit, comprising:
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at least one embedded antenna; at least a residual portion of a first testing device configured to form a wirelessly loopback connection with the first embedded antenna to transform an electromagnetic signal between the first testing device and the first embedded antenna into an electrical signal. - View Dependent Claims (25, 26, 27, 28)
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29. A method, comprising:
testing a semiconductor wafer comprising at least a first integrated circuit having a first embedded antenna by, coupling probes of a probe card to contact pads of the semiconductor wafer; forming a wireless loopback connection between the first embedded antenna and a first test antenna; transmitting an electromagnetic signal between the first embedded antenna and the first test antenna; and transforming the electromagnetic signal into an electrical signal. - View Dependent Claims (30, 31)
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32. A system, comprising:
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a testing device having a faraday cage and configured to communicatively couple to at least one integrated circuit of a semiconductor wafer; and at least one testing antenna configured to form a wireless loopback connection with at least one embedded antenna of the wafer when the testing device is communicatively coupled to the at least one integrated circuit of the semiconductor wafer. - View Dependent Claims (33, 34, 35, 36, 37, 38)
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Specification