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IMAGE SENSOR PACKAGE AND CAMERA MODULE USING SAME

  • US 20110267534A1
  • Filed: 06/14/2010
  • Published: 11/03/2011
  • Est. Priority Date: 04/28/2010
  • Status: Abandoned Application
First Claim
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1. An image sensor package comprising:

  • a transparent substrate comprising an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface to the lower surfaces;

    a mask covering on the upper surface, the lower surface, and the side surface of the substrate;

    two windows correspondingly defined in the mask at the top surface and the bottom surface of the transparent substrate for passing light therethrough;

    a plurality of conductive patterns formed on the mask located at the bottom surface of the transparent substrate;

    an image sensor electrically connected to the conductive patterns;

    a flexible circuit board electrically connected to the conductive patterns, and defining an opening for receiving the image sensor therein.

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