IMAGE SENSOR PACKAGE AND CAMERA MODULE USING SAME
First Claim
Patent Images
1. An image sensor package comprising:
- a transparent substrate comprising an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface to the lower surfaces;
a mask covering on the upper surface, the lower surface, and the side surface of the substrate;
two windows correspondingly defined in the mask at the top surface and the bottom surface of the transparent substrate for passing light therethrough;
a plurality of conductive patterns formed on the mask located at the bottom surface of the transparent substrate;
an image sensor electrically connected to the conductive patterns;
a flexible circuit board electrically connected to the conductive patterns, and defining an opening for receiving the image sensor therein.
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Abstract
The image sensor package includes a transparent substrate, a number of conductive patterns, an image sensor, a flexible circuit board. The conductive patterns are distributed on a surface of the transparent substrate. The image sensor is adhered on the transparent substrate and electrically connected to the conductive patterns. The flexible circuit board is electrically connected to the conductive patterns, and defines an opening for receiving the image sensor therein.
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Citations
20 Claims
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1. An image sensor package comprising:
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a transparent substrate comprising an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface to the lower surfaces; a mask covering on the upper surface, the lower surface, and the side surface of the substrate; two windows correspondingly defined in the mask at the top surface and the bottom surface of the transparent substrate for passing light therethrough; a plurality of conductive patterns formed on the mask located at the bottom surface of the transparent substrate; an image sensor electrically connected to the conductive patterns; a flexible circuit board electrically connected to the conductive patterns, and defining an opening for receiving the image sensor therein. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A camera module comprising:
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a lens module defining a substantially flat bottom thereof; a transparent substrate comprising an upper surface, a lower surface opposite to the upper surface, a side surface connecting the upper to the lower surfaces, the transparent substrate directly adhered to the flat bottom of the lens module via the upper surface, a mask covering on the upper surface, the lower surface, and the side surface of the substrate; two windows correspondingly defined in the mask at the top surface and bottom surface of the transparent substrate for the passing light there-through; a plurality of conductive patterns formed on the mask located at the bottom surface of the transparent substrate; an image sensor electrically connected to the conductive patterns; a flexible circuit board electrically connected to the conductive patterns and defining an opening for receiving the image sensor therein. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification