FAN FOR COOLING MULTIPLE PROCESSORS HOUSED IN A SUB-CHASSIS

• US 20110273841A1
• Filed: 05/04/2010
• Published: 11/10/2011
• Est. Priority Date: 05/04/2010
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: PAQUIN, David M., Sabotta, Michael L., Nguyen, John D., Wilson, Larry E.
• Granted Patent: US 8,526,177 B2
• Time in Patent Office: Days
• US Class Current: 361/679.48
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source

Abstract

A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.

Claims

1. A chassis, comprising:

a printed circuit board (PCB); and

a sub-chassis housing multiple processors that couple to the PCB, said sub-chassis is disposed above and parallel to said PCB;

wherein said multiple processors are cooled by a sub-chassis fan disposed on said sub-chassis.

2. The chassis of claim 1, wherein the chassis comprises a 2U server chassis.

3. The chassis of claim 1, wherein said multiple processors are cooled by a chassis fan, at least part of said chassis fan is disposed below said sub-chassis.

4. The chassis of claim 3, wherein said chassis fan is disposed anterior to said sub-chassis and said sub-chassis fan is disposed anterior to said multiple processors.

5. The chassis of claim 1, wherein the sub-chassis fan is disposed on an extension that connects to an enclosure of said sub-chassis that houses said multiple processors.

6. The chassis of claim 5, wherein said enclosure is parallel to at least one surface of said enclosure.

7. The chassis of claim 1, wherein circuit logic is disposed between said sub-chassis and the PCB.

8. A system chassis, comprising:

a chassis fan; and

a node disposed posterior to said chassis fan and capable of being cooled by said chassis fan, the server node comprising;

a printed circuit board (PCB);

a sub-chassis, disposed superior to said PCB, housing processors that couple to said PCB; and

sub-chassis fans disposed on said sub-chassis, anterior to said processors and superior to said PCB, said sub-chassis fans adapted to cool said processors;

wherein the chassis comprises a 2U server chassis.

9. The system chassis of claim 8, wherein the system chassis comprises multiple instances of said node.

10. The system chassis of claim 8, wherein said processors are housed within an enclosure of said sub-chassis and said sub-chassis fans are disposed on an extension coupled to said enclosure, and wherein the sub-chassis fans propel air through an orifice and into said enclosure.

11. The system chassis of claim 10, wherein said extension is parallel to at least one surface of the enclosure.

12. The system chassis of claim 8, wherein said sub-chassis fans are disposed superior to said chassis fan.

13. The system chassis of claim 8, wherein a height of at least one of said sub-chassis fans is within 1 centimeter of a height of said sub-chassis.

14. The system chassis of claim 8, wherein circuit logic is disposed between said sub-chassis and said PCB.

15. An apparatus, comprising:

an enclosure that houses multiple processors;

means for coupling a printed circuit board (PCB) to said processors;

an extension that protrudes from said enclosure; and

means for cooling said multiple processors, the means for cooling mounted on said extension and propagating airflow into said enclosure via an orifice;

wherein the processors are disposed superior to said PCB.

16. The apparatus of claim 15, wherein said means for cooling has a height that is within 1 centimeter of a height of said enclosure and wherein said means for cooling has a width that is within 1 centimeter of a width of said enclosure.

17. The apparatus of claim 15, wherein said extension is parallel to at least one surface of said enclosure.