SEMICONDUCTOR DEVICE

• US 20110273861A1
• Filed: 03/22/2011
• Published: 11/10/2011
• Est. Priority Date: 05/07/2010
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: MATSUMOTO, Masafumi, TSUKAMOTO, Hideki, MATSUMOTO, Manabu
• Granted Patent: US 8,526,199 B2
• Time in Patent Office: Days
• US Class Current: 361/820
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 4/34 Conductive members located under head of screw

Abstract

A semiconductor device includes a semiconductor mounting substrate, a mother case having an opening and housing the semiconductor mounting substrate, a plurality of securing members provided along a rim of the mother case, a screw terminal, and a lid member. The screw terminal has a flat plate portion, an insertion portion extending from the flat plate portion, and a terminal bottom portion, is secured to the securing members by insertion of the insertion portion between adjacent securing members, and is electrically connected to the semiconductor mounting substrate on the terminal bottom portion side. The lid member closes the opening with the screw terminal secured to the securing members. The screw terminal is bent such that the flat plate portion faces an upper surface of the lid member closing the opening. The semiconductor device that can achieve reduction in size of the entire device is obtained.

Claims

1. A semiconductor device, comprising:

a semiconductor mounting substrate;

a mother case having an opening and housing said semiconductor mounting substrate;

a plurality of securing members provided along a rim of said mother case constituting said opening;

a screw terminal having a flat plate portion, an insertion portion extending from said flat plate portion, and a terminal bottom portion located opposite to said flat plate portion with said insertion portion interposed between said terminal bottom portion and said flat plate portion, secured to said securing members by insertion of said insertion portion between adjacent said securing members, and electrically connected to said semiconductor mounting substrate on said terminal bottom portion side; and

a lid member capable of closing said opening with said screw terminal secured to said securing members, wherein

said screw terminal secured to said securing members is bent such that said flat plate portion faces an upper surface of said lid member closing said opening.

3. The semiconductor device according to claim 1, wherein

said screw terminal has an extending portion extending from said terminal bottom portion toward said semiconductor mounting substrate.

4. The semiconductor device according to claim 1, wherein

said lid member has

an accommodating groove provided in said upper surface and capable of accommodating a nut having a hexagonal shape in a plan view, and

a plurality of projections provided on an inner wall of said accommodating groove, for limiting movement and rotation of said nut, and

a spacing between adjacent said projections is set such that a top portion of said nut is located between adjacent said projections.

5. The semiconductor device according to claim 1, wherein

said lid member has

an accommodating groove provided in said upper surface and capable of accommodating a nut having a hexagonal shape in a plan view, and

a plurality of projections provided on an inner wall of said accommodating groove, for limiting movement and rotation of said nut, and

a spacing between adjacent said projections is set such that a side portion of said nut is located between adjacent said projections.

6. The semiconductor device according to claim 1, wherein

a nut communicating with an opening provided in said flat plate portion is joined to said screw terminal.

7. The semiconductor device according to claim 1, wherein

said lid member has an accommodating groove in said upper surface, and

said accommodating groove is provided with two flat plate-like members facing each other at a prescribed spacing and each having a thread groove on an opposing surface.

2. A semiconductor device, comprising:

a semiconductor mounting substrate;

a mother case having an opening and housing said semiconductor mounting substrate;

a plurality of securing members provided along a rim of said mother case constituting said opening;

a block having an insertion portion and secured to said securing members by insertion of said insertion portion between adjacent said securing members;

a screw terminal configured to include a flat plate portion and a plurality of terminal bottom portions extending from said flat plate portion, provided to pass through said block and held by said block, and electrically connected to said semiconductor mounting substrate on said plurality of terminal bottom portions side; and

a lid member capable of closing said opening with said block secured to said securing members, wherein

said screw terminal is bent such that said flat plate portion faces an upper surface of said lid member closing said opening, with said block secured to said securing members.