SPEAKER CLIP
First Claim
Patent Images
1. An electronic device comprising:
- a main housing encapsulating operative circuitry for the device;
an attachment member moveably coupled to the main housing with hinge biasing the attachment member in a closed position relative to the main housing; and
an acoustical device positioned within the attachment member, the acoustical device communicatively coupled to the operative circuitry in the main housing, wherein the attachment member comprises a recessed portion for positioning the acoustical device within the attachment member.
1 Assignment
0 Petitions
Accused Products
Abstract
Certain embodiments may take the form of an electronic device having a main housing encapsulating operative circuitry for the device. The electronic device includes an attachment member moveably coupled to the metal housing. The attachment member has an acoustical device located therein that is communicatively coupled to the operative circuitry in the main housing. The attachment member includes a recessed portion for positioning the acoustical device within the attachment member.
296 Citations
20 Claims
-
1. An electronic device comprising:
-
a main housing encapsulating operative circuitry for the device; an attachment member moveably coupled to the main housing with hinge biasing the attachment member in a closed position relative to the main housing; and an acoustical device positioned within the attachment member, the acoustical device communicatively coupled to the operative circuitry in the main housing, wherein the attachment member comprises a recessed portion for positioning the acoustical device within the attachment member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A small form factor, electronic device comprising:
-
a main housing holding a processor of the electronic device; an attachment clip moveably coupled to the main housing, the attachment clip having a cavity; an acoustical device located within the cavity of the attachment clip; and a conduit communicatively coupling the acoustical device and the processor, wherein the attachment device is less than approximately 1.33 mm thick where the acoustical device is located. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A method of manufacturing a small form factor electronic device comprising:
-
milling a main housing; milling an attachment member; creating a recessed region within the attachment member; positioning an acoustical device within the recessed region of the attachment member; applying at least one adhesive layer over acoustical device; positioning a cover layer over the at least one adhesive layer; and coupling the main housing to the attachment member. - View Dependent Claims (20)
-
Specification