VEHICLE COLLISION STRESS WAVE SENSOR

• US 20110277551A1
• Filed: 07/27/2011
• Published: 11/17/2011
• Est. Priority Date: 06/15/2009
• Status: Active Grant

• Current Assignee: Aptiv Technologies AG
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: LOW, YEW KWANG, YEO, CHEE KENG, LEONG, DANIEL, YEO, KOK WEE
• Granted Patent: US 8,499,644 B2
• Time in Patent Office: Days
• US Class Current: 73/760
• CPC Class Codes: G01L 1/2206 Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
• CPC Class Codes: G01L 5/0052 measuring forces due to impact G01L5/0061, G01L5/14 take precedence; impact testing of structures G01M7/08; impact testing of material G01N3/00

Abstract

A sensor configured to detect a stress wave propagating through a vehicle frame member caused by a vehicle collision is provided. The sensor includes a sensor body configured to be rigidly coupled to the vehicle frame member, a first strain sensing device and a second strain sensing device attached to the sensor body. The sensor body is configured to exhibit stress in response to transverse and torsional stress wave propagating along the vehicle frame member. The first strain sensing device generates a first signal indicative of stress in the sensor body and the second strain sensing device generates a second signal indicative of stress in the sensor body. A first end portion of the sensor body is characterized as trapezoidal prism shaped and a second end portion of the sensor body is characterized as trapezoidal prism shaped.

Claims

1. A sensor configured to detect a stress wave propagating through a vehicle frame member, comprising:

a sensor body configured to be rigidly coupled to the vehicle frame member at a first contact surface and a second contact surface separated from the first contact surface;

a first strain sensing device attached to the sensor body at a first location on the sensor body in a manner effective to detect stress in the sensor body at the first location; and

a second strain sensing device attached to the sensor body at a second location on the sensor body in a manner effective to detect stress in the sensor body at the second location, wherein said second location is distinct from the first location,

wherein said sensor body is configured to exhibit stress at the first location and at the second location in response to the stress wave propagating along the vehicle frame member, whereby the first strain sensing device generates a first signal indicative of stress in the sensor body at the first location and the second strain sensing device generates a second signal indicative of stress in the sensor body at the second location,

wherein the first contact surface is defined by a first end portion of the sensor body characterized as trapezoidal prism shaped that further defines a first non-parallel surface characterized as not parallel to the first contact surface, and the second contact surface is defined by a second end portion of the sensor body characterized as trapezoidal prism shaped that further defines a second non-parallel surface characterized as not parallel to the second contact surface.

2. The sensor of claim 1, wherein the first non-parallel surface and the second non-parallel surface are noncoplanar.

3. The sensor of claim 1, wherein the sensor body defines a third portion of the sensor body disposed between the first non-parallel surface and the second non-parallel surface and characterized as an elastic beam, wherein the third portion is arcuate-shaped.

4. The sensor of claim 1, wherein the first non-parallel surface is opposite the first contact surface and the second non-parallel surface is opposite the second contact surface.

5. The sensor of claim 1, further comprising a microprocessor receiving the first signal and the second signal, wherein the microprocessor is configured to generate a third signal indicative of a vehicle collision event when at least one of the first signal and the second signal exceeds a signal threshold.

6. The sensor of claim 5, wherein the microprocessor is disposed within the sensor body.

7. The sensor of claim 1, further comprising a housing configured to be rigidly coupled to the vehicle frame member, wherein the housing defines a cavity therein, wherein the sensor body is disposed within the cavity and is rigidly coupled to the housing.

8. The sensor of claim 7, wherein a body portion of the housing is characterized as a rectangular prism shape.

9. The sensor of claim 8, wherein the housing includes a first post portion rigidly coupled to the body portion, a second post portion rigidly coupled to the body portion, and a third post portion rigidly coupled to the body portion, wherein the first post portion, the second post portion, and the third post portion are configured to be rigidly coupled to the vehicle frame member.

10. A stress wave sensor, comprising:

a first end portion, wherein the first end portion is characterized as trapezoidal prism shaped that further defines a first non-parallel surface;

a second end portion, wherein the second end portion is characterized as trapezoidal prism shaped that further defines a second non-parallel surface;

a third portion coupled between the first non-parallel surface of the first end portion and the second non-parallel surface of the second end portion, wherein the third portion is an arcuate-shaped plate member, wherein the third portion has a third thickness less than a first thickness of the first end portion and a second thickness of the second end portion such that the third portion deflects when receiving a stress wave;

a first strain sensing device coupled to both the first end portion and the third portion; and

a second strain sensing device coupled to both the first end portion and the third portion, whereby the first strain sensing device and the second strain sensing device generating a first signal and a second signal, respectively, in response to the first strain sensing device and the second strain sensing device detecting a deflection of the third portion due to stress waves propagating through the third portion.