PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE

• US 20110278610A1
• Filed: 05/11/2010
• Published: 11/17/2011
• Est. Priority Date: 05/11/2010
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Lee, Hyunil, Jeong, Hyunsoo, Lee, Seongoo, Park, Ryungshik
• Granted Patent: US 8,450,770 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A light emitting diode (LED) package structure comprising a carrier, an LED chip, a first encapsulant, at least one bonding wire, a plurality of phosphor particles and a second encapsulant is provided. The LED chip is disposed on the carrier. The LED chip has at least one electrode. The first encapsulant is disposed on the carrier and covering the LED chip. The first encapsulant is provided with at least one preformed opening exposing at least a portion of the at least one electrode. The at least one bonding wire is electrically connected between the at least one electrode and the carrier via the at least one preformed opening. The phosphor particles are distributed within the first encapsulant. The second encapsulant is disposed on the carrier and encapsulates the LED chip, the first encapsulant and the at least one bonding wire.

Claims

1. A light emitting diode (LED) package structure, comprising:

a carrier;

an LED chip disposed on the carrier, the LED chip having at least one electrode;

a first encapsulant disposed on the carrier and covering the LED chip, the first encapsulant being provided with at least one preformed opening exposing at least a portion of the at least one electrode;

at least one bonding wire electrically connected between the at least one electrode and the carrier via the as least one preformed opening;

a plurality of phosphor particles distributed within the first encapsulant; and

a second encapsulant, disposed on the carrier and encapsulating the LED chip, the first encapsulant and the at least one bonding wire.

2. The LED package structure according to claim 1, wherein the first encapsulant covers the entire LED chip except the exposed portion of the at least one electrode and a bottom surface of the LED chip facing the carrier.

3. The LED package structure according to claim 1, wherein a bottom surface of the LED chip is coplanar with a bottom surface of the first encapsulant.

4. The LED package structure according to claim 1, further comprising a substrate disposed between the LED chip and the carrier, wherein a side surface of the first encapsulant is coplanar with a side surface of the substrate.

5. The LED package structure according to claim 1, further comprising a lining layer disposed between the LED chip and the carrier, wherein a bottom surface of the lining layer is coplanar with a bottom surface of the first encapsulant.

6. The LED package structure according to claim 1, wherein the carrier has a cavity accommodating the spacer, the LED chip and the junction coating.

7. The LED package structure according to claim 5, wherein the cavity is filled with the second encapsulant, while a top surface of the second encapsulant is coplanar with a top surface of the carrier surrounding the cavity.

8. The LED package structure according to claim 1, wherein a profile of the second encapsulant is in a convex lens shape.

9. The LED package structure according to claim 1, wherein the carrier comprises a metal leadframe, a pre-molded metal leadframe or a circuit substrate.

10. The LED package structure according to claim 1, wherein the LED chip has a first electrode and a second electrode both disposed on a top surface of the LED chip, while the first electrode and the second electrode are respectively electrically connected to the carrier via a first bonding wire and a second bonding wire.

11. An LED package process, comprising:

disposing a plurality of LED chips on a substrate, each of the LED chips having at least one electrode;

forming at least one sacrifice bump on the at least one electrode of each of the LED chips;

forming a first encapsulant on the substrate to cover the LED chips and the at least one sacrifice bumps on each of the LED chips, wherein the first encapsulant is mixed with a plurality of phosphor particles;

thinning the first encapsulant from a top side of the first encapsulant to expose a top portion of the at least one sacrifice bump on each of the LED chips;

etching the at least one sacrifice bump on each of the LED chips to form an opening in the first encapsulant, the opening exposing at least a portion of the at least one electrode of each of the LED chips;

performing a singulation process to separate the LED chips from one another to obtain a plurality of LED units;

bonding one of the LED units to a carrier and electrically connecting the at least one electrode of the LED chip of the LED unit to the carrier by at least one bonding wire via the opening; and

forming a second encapsulant on the carrier to encapsulate the LED unit and the at least one bonding wire.

12. The LED package process according to claim 11, further comprising removing the substrate before the singulation process and after forming the first encapsulant.

13. The LED package process according to claim 12, wherein the substrate is removed by etching together with the at least one sacrifice bump on each of the LED chips.

14. The LED package process according to claim 11, further comprising forming a lining layer between each of the LED chip and the substrate.

15. The LED package process according to claim 11, wherein the singulation process comprises sawing the first encapsulant between two adjacent LED chips.

16. The LED package process according to claim 15, wherein the singulation process further comprises sawing the substrate together with the first encapsulant between two adjacent LED chips.

17. The LED package process according to claim 15, wherein the LED unit is bonded to the carrier with the separation of the sawed substrate therebetween.

18. The LED package process according to claim 11, wherein the first encapsulant is formed by dispensing, printing or molding.

19. The LED package process according to claim 11, wherein the second encapsulant is formed by dispensing, printing or molding.