LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

• US 20110278627A1
• Filed: 07/26/2011
• Published: 11/17/2011
• Est. Priority Date: 12/21/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: Geun-Ho Kim, Seung Yeob Lee, Yu H.O. Won
• Inventors: Lee, Seung Yeob, Won, Yu Ho, KIM, Geun-Ho
• Granted Patent: US 8,546,838 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, and a method for manufacturing the same are disclosed. The method includes forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.

Claims

1. A light emitting device package, comprising:

a substrate comprising a first surface, a second surface, and a through hole;

a first electrode on the first surface, wherein the first electrode has a pair of portions;

a light emitting device on the first surface, wherein the light emitting device is arranged on the pair of portions, wherein the first electrode is electrically connected to the light emitting device;

a second electrode on the second surface, the second electrode electrically connected to the first electrode;

a zener diode on the first surface, the zener diode electrically connected to the first electrode,

wherein the zener diode is laterally arranged with respect to the light emitting device, and

wherein the light emitting device and the zener diode are arranged on a same side of the first electrode; and

an encapsulation on the light emitting device.

2. The light emitting device package according to claim 1, wherein the zener diode comprises:

a semiconductor layer; and

a diffusion region on the semiconductor layer.

3. The light emitting device package according to claim 2, wherein the semiconductor layer has a first conductivity and the diffusion region has a second conductivity that is opposite to the first conductivity.

4. The light emitting device package according to claim 1, wherein the substrate comprises at least one material of PCB, BeO, SiO, Si, Al, AlO_x, PSG, a synthetic resin material, ceramic, and Al₂O₃.

5. The light emitting device package according to claim 1, wherein the substrate comprises at least one of AlN, SiC, and Graphite.

6. The light emitting device package according to claim 1, wherein the light emitting device and the zener diode are located on a substantially same plane.

7. The light emitting device package according to claim 1, further comprising:

a phosphor material arranged on the light emitting device.

8. The light emitting device package according to claim 1, wherein the encapsulation contains a phosphor material.

9. The light emitting device package according to claim 8, wherein the phosphor material comprises a yellow phosphor material.

10. The light emitting device package according to claim 1, wherein the substrate has a heat transfer coefficient of 100 W/mK or more.

11. The light emitting device package according to claim 1, wherein the light emitting device is bonded to the first electrode with a conductive material.

12. The light emitting device package according to claim 1, wherein the second electrode is electrically connected to the first electrode via a metal or a conductive material arranged in the through hole.

13. The light emitting device package according to claim 12, wherein the through hole is fully or partially filled with the metal or the conductive material.

14. The light emitting device package according to claim 1, wherein the light emitting device is on a center of the first surface.

15. The light emitting device package according to claim 1, wherein the first electrode comprises a metal having high reflectivity in at least one wavelength range of visible light, ultraviolet light, and infrared light.

16. The light emitting device package according to claim 1, wherein the first electrode comprises at least one of Al, Ag, Cr, and Mo.

17. The light emitting device package according to claim 1, wherein the encapsulation comprises epoxy or silicone.

18. The light emitting device package according to claim 1, wherein at least one of the second electrode and the through hole comprises a pair of portions.

19. The light emitting device package according to claim 18, wherein a shortest distance between the light emitting device and the zener diode is shorter than a shortest distance between the pair of portions of the through hole.

20. The light emitting device package according to claim 18, wherein the pair of portions of the first electrode and the pair of portions of the second electrode are connected via a metal or a conductive material arranged in the pair of portions of the through hole.

21. The light emitting device package according to claim 1, wherein the substrate has a rectangular parallelepiped shape.

22. The light emitting device package according to claim 1, wherein the first electrode and the second electrode directly contact the substrate.

23. The light emitting device package according to claim 1, wherein a portion of the zener diode is configured to provide a reflective surface.

24. The light emitting device package according to claim 1, wherein the zener diode is located a predetermined distance apart from a center of the first surface.

25. The light emitting device package according to claim 1, wherein the first electrode is connected to the light emitting device via conductive bonding material.

26. The light emitting device package according to claim 1, wherein the first electrode covers the first surface.

27. The light emitting device package according to claim 1, wherein the light emitting device is on a first portion of the first electrode and the zener diode is on a second portion of the first electrode.

28. The light emitting device package according to claim 18, wherein widths of the pair of portions of the second electrode are substantially the same.

29. The light emitting device package according to claim 1, wherein a size of the through hole at the first surface is substantially the same as a size of the through hole at the second surface.

30. The light emitting device package according to claim 1, wherein a shortest distance between the light emitting device and the first surface and a shortest distance between the zener diode and the first surface are substantially the same.