CIRCUIT DEVICE WITH SIGNAL LINE TRANSITION ELEMENT

• US 20110279190A1
• Filed: 05/12/2010
• Published: 11/17/2011
• Est. Priority Date: 05/12/2010
• Status: Active Grant

• Current Assignee: MediaTek, Inc., Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: International Business Machines Corporation, MediaTek, Inc.
• Inventors: Floyd, Brian Allan, Liu, Duixian, Chen, Ho-Chung
• Granted Patent: US 8,558,637 B2
• Time in Patent Office: Days
• US Class Current: 333/35
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15323 being a land array, e.g. LGA
• CPC Class Codes: H01P 5/028 between strip lines
• CPC Class Codes: H01P 5/085 Coaxial-line/strip-line transitions

Abstract

A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.

Claims

1. A circuit device, comprising:

a multilayer circuit carrier comprising a plurality of layers including a first layer and a second layer;

a first signal transmission line, disposed on a surface of the first layer;

a second signal transmission line, disposed on a surface of the second layer;

a signal line transition element, passing through at least the first layer and the second layer, the signal line transition element having a first signal terminal formed on the surface of the first layer and a second signal terminal formed on the surface of the second layer;

a first impedance transformer, disposed on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal, for providing impedance matching between the first signal transmission line and the signal line transition element; and

a second impedance transformer, disposed on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal, for providing impedance matching between the second signal transmission line and the signal line transition element.

2. The circuit device of claim 1, wherein at least one of the first impedance transformer and the second impedance transformer is implemented by a quarter wavelength transformer.

3. The circuit device of claim 1, wherein at least one of the first impedance transformer and the second impedance transformer is implemented by a multiple-stub matching network.

4. The circuit device of claim 3, wherein the multiple-stub matching network has a plurality of open-circuited stubs or a plurality of short-circuited stubs.

5. The circuit device of claim 1, wherein at least one of the first impedance transformer and the second impedance transformer is implemented by a single-stub matching network.

6. The circuit device of claim 5, wherein the single-stub matching network has a short-circuited stub or an open-circuited stub.

7. The circuit device of claim 1, further comprising:

a line segment, electrically connected between the signal line transition element and one of the first impedance transformer and the second impedance transformer, the line segment arranged to convert complex input impedance of the signal line transition element into purely real impedance viewed by the one of the first impedance transformer and the second impedance transformer.

8. The circuit device of claim 1, wherein the signal line transition element comprises a signal via which passes through at least the first layer and the second layer in a thickness direction of the multilayer circuit carrier, and two ends of the signal via serve as the first signal terminal and the second signal terminal, respectively.

9. The circuit device of claim 8, further comprising:

a reference voltage plane, disposed on one of the layers and arranged to deliver a predetermined reference voltage;

wherein the signal via further passes through the reference voltage plane.

10. The circuit device of claim 8, wherein the signal line transition element further comprises:

a plurality of shielding vias disposed around the signal via, each of the shielding vias arranged to transmit a predetermined reference voltage.

11. The circuit device of claim 1, wherein the signal line transition element is a coaxial-like transmission line.

12. The circuit device of claim 1, further comprising:

an antenna, carried by the multilayer circuit carrier;

wherein the first signal transmission line is an antenna feed line of the antenna.

13. The circuit device of claim 12, further comprising:

a semiconductor die, mounted on the surface of the second layer and electrically connected to the second signal terminal, wherein the semiconductor die has a radio frequency (RF) signal processing capability.

14. The circuit device of claim 13, wherein the semiconductor die is accommodated in an open cavity of the multilayer circuit carrier.

15. The circuit device of claim 12, wherein the antenna is a slot antenna.

16. The circuit device of claim 12, wherein the antenna is an aperture-coupled patch antenna including a patch and an antenna ground plane, and the antenna ground plane is disposed between the patch and the antenna feed line and has an aperture.

17. The circuit device of claim 16, wherein the patch is accommodated in an internal cavity of the multilayer circuit carrier.

18. The circuit device of claim 12, wherein the antenna is a patch antenna including a patch disposed on the surface of the first layer and an antenna ground plane, the signal line transition element further passes through the antenna ground plane, and the first signal transmission line is coupled to an edge of the patch.

19. The circuit device of claim 1, further comprising:

a heat dissipater, integrated in the multilayer circuit carrier.