MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MODULE WITH FIXED FOCAL LENGTH
First Claim
1. A manufacturing method for a wafer level image sensor module with fixed focal length, comprising steps of:
- providing a silicon wafer including a plurality of image sensor chips wherein each said image sensor chip has a photosensitive area;
providing a lens module array wafer that includes a plurality of wafer level lens modules, wherein each said wafer level lens module has a fixed focal length;
sorting the image sensor chips and the wafer level lens modules in grades according to different quality grades;
according to the sorting results, assigning each said wafer level lens module to be situated above the image sensor chip that has the same grade and making each said wafer level lens module aligned with a respective said photosensitive area; and
performing a packaging process by applying an encapsulation material onto a first surface of the silicon wafer, and making the encapsulation material surround the wafer level lens modules.
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Abstract
This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material.
12 Citations
14 Claims
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1. A manufacturing method for a wafer level image sensor module with fixed focal length, comprising steps of:
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providing a silicon wafer including a plurality of image sensor chips wherein each said image sensor chip has a photosensitive area; providing a lens module array wafer that includes a plurality of wafer level lens modules, wherein each said wafer level lens module has a fixed focal length; sorting the image sensor chips and the wafer level lens modules in grades according to different quality grades; according to the sorting results, assigning each said wafer level lens module to be situated above the image sensor chip that has the same grade and making each said wafer level lens module aligned with a respective said photosensitive area; and performing a packaging process by applying an encapsulation material onto a first surface of the silicon wafer, and making the encapsulation material surround the wafer level lens modules. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A structure for a wafer level image sensor module with fixed focal length, comprising:
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an image sensor chip including a plurality of photosensitive elements that are situated in a photosensitive area on a first surface of the image sensor chip;
a plurality of first contacts provided on the first surface and electrically connected to the photosensitive elements; and
a plurality of conducting channels passing through the image sensor chip and having one end electrically connected to the first contacts;a wafer level lens module correspondingly situated above the photosensitive area and having a fixed focal length; and an encapsulation material situated on the first surface and surrounding the wafer level lens module. - View Dependent Claims (11, 12, 13, 14)
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Specification