RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME

• US 20110284855A1
• Filed: 01/15/2010
• Published: 11/24/2011
• Est. Priority Date: 01/29/2009
• Status: Active Grant

• Current Assignee: Toray Industries Incorporated
• Original Assignee: Toray Industries Incorporated
• Inventors: Tomikawa, Masao, Miyoshi, Kazuto, Koshino, Mika
• Granted Patent: US 8,709,552 B2
• Time in Patent Office: Days
• US Class Current: 257/59
• CPC Class Codes: C08G 73/10 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08G 73/22 Polybenzoxazoles
• CPC Class Codes: C08K 5/13 Phenols; Phenolates
• CPC Class Codes: C08K 5/17 Amines; Quaternary ammonium compounds
• CPC Class Codes: C08L 79/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09K 11/06 containing organic luminescent materials
• CPC Class Codes: C09K 2211/1007 Non-condensed systems
• CPC Class Codes: C09K 2211/1014 bridged by heteroatoms, e.g. N, P, Si or B
• CPC Class Codes: C09K 2211/1044 containing two nitrogen atoms as heteroatoms
• CPC Class Codes: C09K 2211/1059 containing three nitrogen atoms as heteroatoms
• CPC Class Codes: C09K 2323/00 Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
• CPC Class Codes: C09K 2323/025 Polyamide
• CPC Class Codes: C09K 2323/027 Polyimide
• CPC Class Codes: C09K 2323/035 Ester polymer, e.g. polycarbonate, polyacrylate or polyester
• CPC Class Codes: C09K 2323/061 Inorganic, e.g. ceramic, metallic or glass
• CPC Class Codes: G02B 1/04 made of organic materials, e.g. plastics G02B1/08 takes precedence
• CPC Class Codes: G03F 7/0007 Filters, e.g. additive colour filters; Components for display devices
• CPC Class Codes: G03F 7/037 the binders being polyamides or polyimides
• CPC Class Codes: G03F 7/039 Macromolecular compounds which are photodegradable, e.g. positive electron resists G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023
• CPC Class Codes: G03F 7/40 : Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H01L 2224/18 : High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H05B 33/10 : Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H05B 33/14 : characterised by the chemical or physical composition or the arrangement of the electroluminescent material , or by the simultaneous addition of the electroluminescent material in or onto the light source
• CPC Class Codes: H10K 50/865 : comprising light absorbing layers, e.g. light-blocking layers
• CPC Class Codes: H10K 59/122 : Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/124 : Insulating layers formed between TFT elements and OLED elements
• CPC Class Codes: H10K 59/38 : comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 59/8792 : comprising light absorbing layers, e.g. black layers

Abstract

The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.

Claims

1. A resin composition comprising (a) a polyimide, a polybenzoxazole, a polyimide precursor, or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a structure represented by the following formula (1) or a thermal cross-linking agent having a group represented by the following formula (2):

2. A positive type photosensitive resin composition comprising the resin composition according to claim 1 and further (d) a photo acid generator.

3. A negative type photosensitive resin composition comprising the resin composition according to claim 1 and further (e) a photopolymerization initiator and (f) a compound having two or more ethylenically unsaturated bonds.

4. The resin composition according to claim 1, wherein the change in transmission of light having a wavelength of 450 nm before and after cure in a film having a thickness of 3.0 μ

m is 20% or more.

5. A display device comprising a substrate in which a thin film transistor has been formed, a planarization film and/or a dielectric layer obtained by curing the resin composition according to claim 1, and a display element in this order.

6. The display device according to claim 5, wherein the display element is an organic electroluminescent element.

7. The resin composition according to claim 2, wherein the change in transmission of light having a wavelength of 450 nm before and after cure in a film having a thickness of 3.0 μ

m is 20% or more.

8. The resin composition according to claim 3, wherein the change in transmission of light having a wavelength of 450 nm before and after cure in a film having a thickness of 3.0 μ

m is 20% or more.

9. A display device comprising a substrate in which a thin film transistor has been formed, a planarization film and/or a dielectric layer obtained by curing the resin composition according to claim 2, and a display element in this order.

10. A display device comprising a substrate in which a thin film transistor has been formed, a planarization film and/or a dielectric layer obtained by curing the resin composition according to claim 3, and a display element in this order.