LIGHT EMITTING CHIP PACKAGE AND METHOD FOR FORMING THE SAME

• US 20110284887A1
• Filed: 05/21/2010
• Published: 11/24/2011
• Est. Priority Date: 05/21/2010
• Status: Abandoned Application

• Current Assignee: Xintec Incorporated
• Original Assignee: Xintec Incorporated
• Inventors: Liu, Tsang-Yu, WU, Shang-Yi
• Application Number:
  US12/784,933
• Publication Number:
  US 20110284887A1
• Time in Patent Office: Days
• US Class Current: 257/91
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

According to an embodiment of the invention, a light emitting chip package is provided, which includes a carrier substrate having a first surface and an opposite second surface, a cavity extending from the first surface toward the second surface, at least a electrical conductive via and at least a thermal conductive via, located outside of the cavity and penetrating through the first surface and the second surface of the carrier substrate, a light emitting element having contact electrodes and disposed in the cavity, wherein the contact electrode are electrically connected to the electrical conductive via and are electrically insulated from the thermal conductive via.

Claims

1. A light emitting chip package, comprising:

a carrier substrate having a first surface and an opposite second surface;

a cavity extending from the first surface toward the second surface;

at least a electrical conductive via and at least a thermal conductive via, located outside of the cavity and penetrating through the first surface and the second surface of the carrier substrate; and

a light emitting element having at least a contact electrode and disposed in the cavity, wherein the contact electrode is electrically connected to the electrical conductive via and is electrically insulated from the thermal conductive via.

2. The light emitting chip package as claimed in claim 1, wherein the light emitting element comprises a light emitting diode.

3. The light emitting chip package as claimed in claim 1, wherein the light emitting element comprises a plurality of light emitting diodes electrically connected in series with each other.

4. The light emitting chip package as claimed in claim 1, further comprising a reflective structure surrounding the light emitting element.

5. The light emitting chip package as claimed in claim 4, wherein the light emitting element is disposed on a bottom portion of the cavity, and the reflective structure is located on the bottom portion or a sidewall of the cavity.

6. The light emitting chip package as claimed in claim 5, wherein the reflective structure comprises a first reflective layer and a second reflective layer, electrically insulated from each other.

7. The light emitting chip package as claimed in claim 6, wherein the first reflective layer and the second reflective layer are made of a metal material.

8. The light emitting chip package as claimed in claim 7, wherein the first reflective layer is electrically connected to the contact electrode and the electrical conductive via.

9. The light emitting chip package as claimed in claim 8, wherein the second reflective layer is connected to the thermal conductive via and is electrically insulated from the contact electrode and the electrical conductive via.

10. A method for forming a light emitting chip package, comprising:

providing a carrier substrate having a first surface and an opposite second surface;

partially removing the carrier substrate to form at least a first hole extending from the first surface towards the second surface of the carrier substrate;

partially removing the carrier substrate to form at least a second hole extending from the first surface towards the second surface of the carrier substrate;

thinning the carrier substrate from the second surface of the carrier substrate to expose the first hole and the second hole to form at least a first through-hole and at least a second through-hole;

forming a first conducting layer overlying a sidewall of the first through-hole;

forming a second conducting layer overlying a sidewall of the second through-hole; and

disposing a light emitting element overlying the first surface, wherein the light emitting element has a contact electrode electrically connected to the first conducting layer.

11. The method for forming a light emitting chip package as claimed in claim 10, wherein the first conducting layer in the first through-hole serves as a electrical conductive via, and the second conducting layer in the second through-hole serves as a thermal conductive via, and wherein the thermal conductive via is electrically insulated from the electrical conductive via and the contact electrode, respectively.

12. The method for forming a light emitting chip package as claimed in claim 11, further comprising:

forming a cavity extending from the first surface towards the second surface;

disposing the light emitting element overlying a bottom portion of the cavity; and

forming a reflective structure overlying a sidewall or a bottom portion of the cavity.

13. The method for forming a light emitting chip package as claimed in claim 12, wherein the reflective structure comprises a first reflective layer and a second reflective layer, electrically insulated from each other.

14. The method for forming a light emitting chip package as claimed in claim 13, wherein the first through-hole and the second through-hole surround the cavity.

15. The method for forming a light emitting chip package as claimed in claim 12, wherein the cavity, the first hole, and the second hole are formed simultaneously.

16. The method for forming a light emitting chip package as claimed in claim 10, wherein the first hole and the second hole are formed simultaneously.

17. The method for forming a light emitting chip package as claimed in claim 13, wherein the first conducting layer and the second conducting layer extend overlying the sidewall or the bottom portion of the cavity to serve as the first reflective layer and the second reflective layer, respectively.

18. The method for forming a light emitting chip package as claimed in claim 10, wherein the light emitting element comprises a plurality of light emitting diodes electrically connected in series with each other.