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Stacked Memory Devices And Method Of Manufacturing The Same

  • US 20110286275A1
  • Filed: 05/20/2011
  • Published: 11/24/2011
  • Est. Priority Date: 05/24/2010
  • Status: Active Grant
First Claim
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1. A stacked memory device comprising:

  • at least one memory unit; and

    at least one peripheral circuit unit arranged at least one of above and below the at least one memory unit,wherein the at least one memory unit includesa memory string array, the memory string array including a plurality of memory strings arranged in a matrix, each of the memory strings including a plurality of memory cells and a string selection device arranged perpendicular to a substrate,a plurality of bit lines, the plurality of bit lines extending in a first direction and connected to ends of the plurality of memory strings; and

    a plurality of string selection pads, the plurality of string selection pads being arrayed in a single line along the first direction and connected to the string selection devices included in the plurality of memory strings.

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