METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA
First Claim
1. A computer-implemented method for determining a position of inspection data in design data space, comprising:
- using a computer system to perform the following steps;
aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites, wherein the data for the alignment sites that is aligned comprises data in each of multiple swaths of inspection data acquired by the inspection system for the wafer, and wherein the alignment sites comprise at least one alignment site in each of the multiple swaths;
determining positions of the at least one alignment site in each of the multiple swaths in design data space based on positions of the predetermined alignment sites in the design data space; and
determining a position of the inspection data in each of the multiple swaths in the design data space based on the positions of the at least one alignment site in each of the multiple swaths in the design data space.
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Accused Products
Abstract
Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least to similar. The method further includes storing results of the binning step in a storage medium.
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Citations
32 Claims
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1. A computer-implemented method for determining a position of inspection data in design data space, comprising:
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using a computer system to perform the following steps; aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites, wherein the data for the alignment sites that is aligned comprises data in each of multiple swaths of inspection data acquired by the inspection system for the wafer, and wherein the alignment sites comprise at least one alignment site in each of the multiple swaths; determining positions of the at least one alignment site in each of the multiple swaths in design data space based on positions of the predetermined alignment sites in the design data space; and determining a position of the inspection data in each of the multiple swaths in the design data space based on the positions of the at least one alignment site in each of the multiple swaths in the design data space. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A system configured to determine a position of inspection data in design data space, comprising:
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a storage medium comprising design data; and a processor coupled to the storage medium, wherein the processor is configured to; align data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites, wherein the data for the alignment sites that is aligned comprises data in each of multiple swaths of inspection data acquired by the inspection system for the wafer, and wherein the alignment sites comprise at least one alignment site in each of the multiple swaths; determine positions of the at least one alignment site in each of the multiple swaths in design data space based on positions of the predetermined alignment sites in the design data space; and determine a position of the inspection data in each of the multiple swaths in the design data space based on the positions of the at least one alignment site in each of the multiple swaths in the design data space.
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32. A system configured to determine a position of inspection data in design data space, comprising:
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an inspection system configured to acquire data for alignment sites on a wafer and multiple swaths of inspection data for the wafer; a storage medium comprising design data; and a processor coupled to the inspection system and the storage medium, wherein the processor is configured to; align the data for the alignment sites on the wafer with data for predetermined alignment sites, wherein the data for the alignment sites that is aligned comprises data in each of the multiple swaths of the inspection data, and wherein the alignment sites comprise at least one alignment site in each of the multiple swaths; determine positions of the at least one alignment site in each of the multiple swaths in design data space based on positions of the predetermined alignment sites in the design data space; and determine a position of the inspection data in each of the multiple swaths in the design data space based on the positions of the at least one alignment site in each of the multiple swaths in the design data space.
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Specification