LIGHT EMITTING DIODE PACKAGE

• US 20110291135A1
• Filed: 03/02/2011
• Published: 12/01/2011
• Est. Priority Date: 06/01/2010
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: CHEN, LUNG-HSIN, LIN, CHIH-YUNG, HSIEH, MIN-TSUN, TSENG, WEN-LIANG
• Application Number:
  US13/038,385
• Publication Number:
  US 20110291135A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.

Claims

1. A light emitting diode package comprising:

a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity;

a light emitting diode chip fixed on a bottom of the cavity; and

a glass lens secured to the silicon substrate and covering on the light emitting diode chip.

2. The light emitting diode package as claimed in claim 1, wherein the second surface of the silicon substrate has a first electrode area and a second electrode area, and wherein the first electrode area and the second electrode area have a plurality of concaves opposite to the second surface of the silicon substrate.

3. The light emitting diode package as claimed in claim 2, further comprising a plurality of concaves disposed on the second surface of the silicon substrate, a plurality of convexes disposed on tops of the first electrode area and the second electrode area facing to the second surface of the silicon substrate, and wherein the plurality of convexes is engaged in the plurality of concaves to fixedly connect the silicon substrate and the first and second electrode areas together.

4. The light emitting diode package as claimed in claim 1, further comprising a thermal conductive rod in the silicon substrate and separated from the first and second electrode areas, and wherein the light emitting diode chip is fixed on the thermal conductive rod.

5. The light emitting diode package as claimed in claim 4, wherein the thermal conductive rod is copper, aluminum, or alloy.

6. The light emitting diode package as claimed in claim 5, wherein the thermal conductive rod has a bottom portion projecting downwardly to be out of the second surface of the silicon base of the light emitting diode package.

7. The light emitting diode package as claimed in claim 6, wherein the bottom portion of the thermal conductive rod has enlarged width and length to have a plate-shaped configuration, the bottom portion comprising a plurality of concaves in a bottom face thereof.

8. The light emitting diode package as claimed in claim 6, wherein the cavity has a platform, and the glass lens is disposed on the platform of the cavity.

9. The light emitting diode package as claimed in claim 1, wherein the glass lens comprises a plurality of micro-convexes on opposite top and bottom surfaces of the glass lens.

10. The light emitting diode package as claimed in claim 9, wherein the plurality of micro-convexes on the top surface of the glass lens and the plurality of the micro-convexes on the bottom surface of the glass lens are correspondingly located.

11. The light emitting diode package as claimed in claim 1, wherein the glass lens has one of shapes of an arc and a semicircle.

12. The light emitting diode package as claimed in claim 1, wherein the bottom of the cavity has a first wire bonding area and a second wire bonding area, and the second surface of the silicon substrate has a first electrode area and a second electrode area, vias being formed in the silicon substrate and electrically connecting the first bonding area and the first electrode area, and the second bonding area and the second electrode area.

13. The light emitting diode package as claimed in claim 12, wherein the vias are formed by filling through holes defined in the silicon substrate with conductive materials.

14. The light emitting diode package as claimed in claim 12, wherein the light emitting diode chip is fixed on the first wire bonding area and connected electrically to the first wire bonding area and the second wire bonding area by metal wires.