LIGHT-EMITTING-DEVICE PACKAGE AND A METHOD FOR PRODUCING THE SAME

• US 20110291143A1
• Filed: 12/30/2009
• Published: 12/01/2011
• Est. Priority Date: 12/30/2008
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung LED Co., Ltd. (Samsung Electronics Co. Ltd.)
• Inventors: Jeon, Chung Bae, Hwang, Seok Min, Nei, Masami, Kim, Jin Ha
• Granted Patent: US 8,541,801 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.

Claims

1. A light emitting device package comprising:

a substrate with a mounting surface;

a light emitting device bonded to the mounting surface of the substrate;

a light reflecting resin part containing a high reflective material, formed in a space between the light emitting device and the substrate, and extending from a region formed at the space so as to be formed on the substrate around the light emitting device; and

a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.

2. The light emitting device package of claim 1, wherein the light reflecting resin part is formed on an area of 50 percent or more when compared to the entire area of the substrate excluding the region on which the light emitting device is bonded.

3. The light emitting device package of claim 2, wherein the light reflecting resin part is formed on a front surface of the substrate.

4. The light emitting device package of claim 1, wherein the light reflecting resin part is formed to also cover the side surface of the light emitting device.

5. The light emitting device package of claim 1, wherein the substrate is a sub-mount substrate.

6. The light emitting device package of claim 1, wherein the light emitting device comprises:

a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are sequentially formed on a growth substrate and having a mesa structure in which a portion of the first conductive semiconductor layer is exposed;

a first conductive electrode formed on the exposed portion of the first conductive semiconductor; and

a second conductive electrode formed on the second conductive semiconductor layer.

7. The light emitting device package of claim 6, further comprising:

a high reflective ohmic-contact layer formed on the second conductive semiconductor layer.

8. The light emitting device package of claim 6, further comprising:

a bonding pad formed on the substrate; and

a metal bump formed on the bonding pad and electrically connected with the first and second conducive electrodes.

9. The light emitting device package of claim 8, wherein the substrate further comprises a conductive via electrically connected with the bonding pad.

10. A light emitting device package comprising:

a package main body having a cavity;

first and second lead frames coupled with the package main body such that the first and second lead frames are exposed from a lower surface of the cavity and face each other;

at least one light emitting device mounted on one surface of the first and second lead frames;

a wire electrically connecting a lead frame among the first and second lead frames where the light emitting device is not mounted and the light emitting device;

a light reflecting resin part coated with a thickness smaller than that of the light emitting device between a side surface of the light emitting device and a side wall of the cavity and containing a high reflective material; and

a packing resin part hermetically sealed at an inner side of the cavity to cover the light emitting device.

11. The light emitting device package of claim 10, wherein the cavity has a step portion.

12. The light emitting device package of claim 11, wherein the step portion has a height smaller than the thickness of the light emitting device.

13. The light emitting device package of claim 10, wherein the light emitting device comprises:

a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are sequentially stacked;

a conductive substrate formed on the second conductive semiconductor layer; and

a first conductive electrode formed on a lower surface of the first conductive semiconductor layer.

14. The light emitting device package of claim 10, wherein the light emitting device comprises:

a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are sequentially formed on a growth substrate and having a mesa structure in which a portion of the first conductive semiconductor layer is exposed;

a first conductive electrode formed on the exposed portion of the first conductive semiconductor; and

a second conductive electrode formed on the second conductive semiconductor layer.

15. The light emitting device package of claim 10, wherein the light reflecting resin part comprises the high reflective material so as to have a diffusion reflectance of 70 percent or larger.

16. The light emitting device package of claim 10, wherein the high reflective material has electrical insulation characteristics.

17. The light emitting device package of claim 10, wherein the high reflective material is TiO₂ or Al₂O₃.

18. The light emitting device package of claim 10, wherein the high reflective material is powder particles.

19. The light emitting device package of claim 18, wherein the powder particles are coated to restrain a photocatalyst reaction.

20. The light emitting device package of claim 10, wherein the packing resin part comprises a phosphor material or a quantum dot.

21. A method for fabricating a light emitting device package, the method comprising:

sequentially forming a bonding pad and a metal bump on a substrate;

flipchip-bonding a light emitting device on the metal bump;

forming a light reflecting resin part containing a high reflective material, filling a space between the light emitting device and the substrate, and extending to the vicinity of the light emitting device on the substrate; and

dicing the substrate so as to be separated into individual light emitting device packages.

22. The method of claim 21, further comprising:

forming a packing resin part to cover the light emitting device and the light reflecting resin part before separating the substrate into the individual light emitting device packages.

23. The method of claim 21, wherein, in forming the light reflection resin part, the light reflecting resin part is formed on an area of 50 percent or more when compared to the entire area of the substrate excluding the region on which the light emitting device is bonded.

24. The method of claim 23, wherein, in forming the light reflection resin part, the light reflecting resin part is formed on a front surface of the substrate.

25. The method of claim 21, wherein, in forming the light reflection resin part, the light reflecting resin part is formed to also cover a side surface of the light emitting device.

26. A method for fabricating a light emitting device package, the method comprising:

preparing a package main body having a cavity;

coupling first and second lead frames to the package main body such that they are exposed from a lower surface of the cavity and face each other;

mounting a light emitting device on an upper surface of one of the first and second lead frames through die bonding;

forming a wire to electrically connect the light emitting device with a lead frame on which the light emitting device is not mounted among the first and second lead frames;

forming a light reflecting resin part containing a high reflective material with a thickness smaller than that of the light emitting device such that the light reflecting resin part is coated on a side surface of the light emitting device and on a side wall of the cavity; and

forming a packing resin part at an inner side of the cavity to cover the light emitting device.

27. The method of claim 26, wherein, in preparing the package main body, the cavity is formed to have a step portion.

28. The method of claim 27, wherein the step portion is formed to have a height not larger than the thickness of the light emitting device from the lower surface of the cavity.

29. The method of claim 26, wherein the high reflective material is TiO₂ or Al₂O₃.

30. The method of claim 26, wherein the high reflective material is powder particles.

31. The method of claim 29, wherein the powder particles are coated to restrain a photocatalyst reaction.

32. The method of claim 26, wherein the packing resin part comprises a phosphor material or a quantum dot.

33. The method of claim 26, further comprising:

applying heat to harden the light reflecting resin part and the packing resin part after forming the light reflecting resin part and forming the packing resin part.