LIGHT EMITTING DEVICE AND LIGHTING APPARATUS

• US 20110291151A1
• Filed: 05/24/2011
• Published: 12/01/2011
• Est. Priority Date: 05/26/2010
• Status: Active Grant

• Current Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: IZUMI, Masahiro, MATSUDA, Shuhei, MORIKAWA, Kazuto, TAKENAKA, Erika, NISHIMURA, Kiyoshi, SANPEI, Tomohiro
• Granted Patent: US 8,368,113 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 7/06 with parabolic curvature
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

Claims

1. A light emitting device comprising:

a ceramics substrate;

a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection;

a light emitting element mounted on the metallic thermally-conductive layer; and

a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

2. The light emitting device according to claim 1, wherein a ratio of a junction area between the metallic thermally-conductive layer and one light emitting element to an area of the thermally-conductive layer per light emitting element ranges between 5% or more and 40% or less.

3. A lighting apparatus comprising:

a lighting apparatus main body; and

the light emitting device according to claim 1 mounted on the lighting apparatus main body.