METHOD OF ASSEMBLING CHIPS
4 Assignments
0 Petitions
Accused Products
Abstract
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
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Citations
37 Claims
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1-16. -16. (canceled)
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17. A chip package comprising:
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a carrier comprising a glass substrate; a first chip over said carrier and an opening in said glass substrate, wherein said opening passes completely through said glass substrate; a first metal bump between said first chip and said carrier, wherein said first metal bump comprises a first copper pillar between said first chip and said carrier and a solder between said first copper pillar and said carrier, wherein said first copper pillar has a height greater than a vertical distance between said first copper pillar and said carrier; and multiple solder balls under said carrier. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A chip package comprising:
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an organic substrate; a first chip over said organic substrate; a first copper bump between said first chip and said organic substrate, wherein said first copper bump has a height greater than a vertical distance between said first copper bump and said organic substrate; a first tin-and-gold-containing alloy between said first copper bump and said organic substrate; an encapsulating material between said first chip and said organic substrate, wherein said encapsulating material contacts said first chip, said organic substrate and a sidewall of said first copper bump. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37)
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Specification