SEMICONDUCTOR-DEVICE COOLING STRUCTURE AND POWER CONVERTER
First Claim
Patent Images
1. A semiconductor-device cooling structure comprising:
- a semiconductor device that generates heat; and
a cooler that includes a first cooling element on which the semiconductor device is directly mounted through a connecting member and a second cooling element, the first cooling element having a first heat capacity, the second cooling element having a second heat capacity higher than the first heat capacity.
1 Assignment
0 Petitions
Accused Products
Abstract
A power converter includes a plurality of semiconductor modules each including a semiconductor device that generates heat and a cooler that includes a first cooling element, on which the semiconductor device is directly mounted through a connecting member, and a second cooling element having a higher heat capacity than the first cooling element, and an insulating casing receiving the semiconductor modules to electrically isolate the semiconductor devices from each other.
-
Citations
12 Claims
-
1. A semiconductor-device cooling structure comprising:
-
a semiconductor device that generates heat; and a cooler that includes a first cooling element on which the semiconductor device is directly mounted through a connecting member and a second cooling element, the first cooling element having a first heat capacity, the second cooling element having a second heat capacity higher than the first heat capacity. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A power converter comprising:
-
a plurality of semiconductor modules each including a semiconductor device that generates heat and a cooler that includes a first cooling element, on which the semiconductor device is directly mounted through a connecting layer, and a second cooling element having a higher heat capacity than the first cooling element; and an insulating casing that receives the semiconductor modules to electrically isolate the semiconductor modules from each other. - View Dependent Claims (9)
-
-
10. A power converter comprising:
-
a plurality of cooling elements; a plurality of semiconductor devices each of which is mounted on the corresponding cooling element through a connecting layer; and an insulating layer disposed between the adjacent cooling elements. - View Dependent Claims (11, 12)
-
Specification