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SEMICONDUCTOR-DEVICE COOLING STRUCTURE AND POWER CONVERTER

  • US 20110292611A1
  • Filed: 08/09/2011
  • Published: 12/01/2011
  • Est. Priority Date: 02/09/2009
  • Status: Abandoned Application
First Claim
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1. A semiconductor-device cooling structure comprising:

  • a semiconductor device that generates heat; and

    a cooler that includes a first cooling element on which the semiconductor device is directly mounted through a connecting member and a second cooling element, the first cooling element having a first heat capacity, the second cooling element having a second heat capacity higher than the first heat capacity.

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