METHOD OF MANUFACTURING A PACKAGE CARRIER FOR ENCLOSING AT LEAST ONE MICROELECTRONIC ELEMENT AND METHOD OF MANUFACTURING A DIAGNOSTIC DEVICE

• US 20110292633A1
• Filed: 08/02/2011
• Published: 12/01/2011
• Est. Priority Date: 11/09/2005
• Status: Active Grant

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Ansems, Will J.H., Cornelis Van Den Ackerveken, Antonius Constant Johanna, Weekamp, Johannes Wilhelmus
• Granted Patent: US 8,351,222 B2
• Time in Patent Office: Days
• US Class Current: 361/820
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0627 Sensor or part of a sensor is integrated
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0838 Capillaries
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: H01L 2224/85385 Shape, e.g. interlocking features
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 13/046 Surface mounting surface mounted components H05K3/341
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 7/00 Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/4981 : Utilizing transitory attached element or associated separate material

Abstract

A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

Claims

1-11. -11. (canceled)

12. Package carrier, comprising:

a body member having a recess for accommodating a microelectronic element; and

a pattern of electrically conductive connection pads and electrically conductive tracks arranged at one side of the body member such that at least one of the electrically conductive connection pads is present in the recess;

wherein the body member has at least one hole and the recess extends to the hole.

13. The package carrier according to claim 12, further comprising a microelectronic element arranged in the recess of the body member and connected to at least one of the electrically conductive connection pads.

14. Package carrier according to claims 12, further comprising a covering member applied to the body member and having the at least one hole of the body member.

15. Package carrier according to claim 13, wherein the recess with the microelectronic element is filled with an encapsulant.

16. Package carrier according to claim 12, wherein the body member has another recess arranged at another side of the body member than the side where the recess and the electrically conductive pattern are present, and wherein the at least one hole of the body member is present at a bottom of the recess.

17. Package carrier according to claim 16, wherein longitudinal axes of the recesses which are arranged at different sides of the body member extend in different directions.

18-22. -22. (canceled)