SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. A semiconductor device comprising:
- a switch in a surface area of a semiconductor substrate;
a contact plug with an upper surface and a lower surface, the lower surface connected to the switch, the upper surface having a roughness of 0.2 nm or less; and
a functional element on the upper surface of the contact plug.
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Abstract
According to one embodiment, a semiconductor device includes a switch element provided in a surface area of a semiconductor substrate, a contact plug with an upper surface and a lower surface, and a function element provided on the upper surface of the contact plug. The lower surface of the contact plug is connected to the switch element. The upper surface of the contact plug has a maximum roughness of 0.2 nm or less.
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Citations
11 Claims
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1. A semiconductor device comprising:
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a switch in a surface area of a semiconductor substrate; a contact plug with an upper surface and a lower surface, the lower surface connected to the switch, the upper surface having a roughness of 0.2 nm or less; and a functional element on the upper surface of the contact plug. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a semiconductor device, the method comprising:
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forming a contact plug by forming a first metal material; and polishing the first metal material by a CMP-process until a roughness of an upper surface of the contact plug becomes 0.2 nm or less, and wherein the CMP-process is executed by using an acid-slurry comprising a colloidal silica. - View Dependent Claims (6, 7, 8)
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9. A method of manufacturing a semiconductor device, the method comprising:
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forming a contact plug by polishing a first metal material using a CMP-process after forming the first metal material, and smoothing the first metal material using a gas cluster ion beam method after the forming the contact plug, wherein the polishing and the smoothing are executed until a roughness of an upper surface of the contact plug becomes 0.2 nm or less. - View Dependent Claims (10, 11)
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Specification