Insole Comprising an Electronic Chip

• US 20110296710A1
• Filed: 06/01/2011
• Published: 12/08/2011
• Est. Priority Date: 06/02/2010
• Status: Abandoned Application

• Current Assignee: Cairos Technologies Ag
• Original Assignee: Cairos Technologies Ag
• Inventors: Holzer, Christian
• Application Number:
  US13/151,016
• Publication Number:
  US 20110296710A1
• Time in Patent Office: Days
• US Class Current: 36/43
• CPC Class Codes: A43B 17/00 Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
• CPC Class Codes: A43B 3/34 with electrical or electronic arrangements

Abstract

The present invention relates to an insole comprising an electronic chip. To impart improved wearing comfort to the wearer of a shoe equipped with the generic insole, it is provided according to the invention that a module encompassing the chip is removably embedded in the insole.

Claims

1. Insole (1) comprising an electronic chip (2), wherein a module (10) encompassing the chip (2) is removably embedded in the insole (1).

2. Insole (1) according to claim 1, characterized in that the module (10) is arranged in a receiving chamber (8) of the insole (1), the receiving chamber (6) comprising an access opening of variable shape and/or size.

3. Insole (1) according to at least one of the preceding claims, characterized in that the insole (1) comprises a stiffening element (12) which forms the receiving chamber (8) at least in sections.

4. Insole (1) according to at least one of the preceding claims, characterized in that the stiffening element (12) stiffens a heel portion (3) of the insole (1).

5. Insole (1) according to at least one of the preceding claims, characterized in that the module (10) is arranged between the stiffening element (12) and an adjoining or surrounding portion of the insole (1) and preferably directly or indirectly contacts the stiffening element (12) and/or the adjoining or surrounding portion of the insole (1).

6. Insole (1) according to at least one of the preceding claims, characterized in that the stiffening element (12) is formed of a more rigid material than the adjoining or surrounding portion of the insole (1).

7. Insole (1) according to at least one of the preceding claims, characterized in that the stiffening element (12) is inserted in a recess (11) of the insole (1), preferably such that the stiffening element (12) substantially closes and/or fills, preferably completely closes and/or fills, the recess (11), with a surface of the stiffening element (12) ending preferably substantially flush with an adjoining or surrounding surface of the insole (1).

8. Insole (1) according to at least one of the preceding claims, characterized in that the receiving chamber (8) comprises a closure (13) which is preferably formed by the stiffening element (12), the closure (13) being preferably a flexible flap which is cut free out of the material of the stiffening element (12).

9. Insole (1) according to at least one of the preceding claims, characterized in that the module (10) substantially closes and/or fills, preferably completely closes and/or fills, the receiving chamber (8).

10. Insole (1) according to at least one of the preceding claims, characterized in that the module (10) is insertable into and/or removable from the receiving chamber from the bottom side (B) of the insole (1).

11. Insole (1) according to at least one of the preceding claims, characterized in that the chip (2) is arranged in a housing (15, 16) of the module (10) which is preferably reclosable in a watertight manner, the chip (2) protruding preferably at least in sections into a recess (17) in the housing wall.

12. Insole (1) according to at least one of the preceding claims, characterized in that the stiffening element (12) is substantially flat and has an oval contour in its plane of extension.

13. Insole (1) according to at least one of the preceding claims, characterized in that the module (10) is substantially flat and has a substantially egg-shaped contour in its plane of extension, the module (10) being preferably insertable in the receiving chamber (8) such that a thinner end (19) of the module (10) is oriented towards the ball portion (5) of the insole (1) and/or a thicker end of the module (10) is oriented towards the heel portion (5) of the insole (1).

14. Insole (1) according to at least one of the preceding claims, characterized in that the module (10) is flattened in substantially wedge-shaped fashion towards at least one side.

15. Insole (1) according to at least one of the preceding claims, characterized in that the insole (1) comprises an elevation (20) on the top side (A), a recess (11) for the stiffening element (12) being formed on the bottom side (B) of the insole (1) in a corresponding position with respect to the elevation (20).

16. Insole (1) according to at least one of the preceding claims, characterized in that the stiffening element (12) is adhesively connected to an adjoining or surrounding portion of the insole (1).

17. Insole (1) according to at least one of the preceding claims, characterized in that the chip (2) is formed as an active or passive transponder chip and can be in wireless communication with a receiver, which is preferably integrated into a wrist watch.

18. Insole (1) according to at least one of the preceding claims, which is configured as an insole (1) for lawn sports shoes, preferably as an insole for football shoes.