MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING

• US 20110297362A1
• Filed: 08/12/2011
• Published: 12/08/2011
• Est. Priority Date: 01/11/2002
• Status: Active Grant

• Current Assignee: Gregory M. Chrysler, James G. Maveety
• Original Assignee: Gregory M. Chrysler, James G. Maveety
• Inventors: Chrysler, Gregory M., Maveety, James G.
• Granted Patent: US 8,505,613 B2
• Time in Patent Office: Days
• US Class Current: 165/185
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 165/905 Materials of manufacture
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.

Claims

1. A structure comprising:

a die with at least one via within the die, the conduit being proximate to a hot spot, the via being at least partially filled with a heat-dissipating material; and

the via being capable of absorbing heat from the hot spot.

2. The structure of claim 1 wherein the via is capable of dissipating at least a portion of the heat away from the hot spot.

3. The structure of claim 1 wherein the heat dissipating material comprises at least one of tungsten, silver and copper.

4. The structure of claim 1 wherein the via is positioned within the die to provide thermal conductivity for heat dissipation from the hot spot.

5. The structure of claim 1 further comprising a second die proximate to the die.

6. The structure of claim 1 wherein at least a portion of the via extends through the die.

7. The structure of claim 1 wherein a portion of the via extends through a backside of the die.