Please download the dossier by clicking on the dossier button x
×

APPARATUS AND METHOD FOR CURRENT SENSING USING A WIRE BOND

  • US 20110298538A1
  • Filed: 06/03/2010
  • Published: 12/08/2011
  • Est. Priority Date: 06/03/2010
  • Status: Active Grant
First Claim
Patent Images

1. An apparatus for sensing power amplifier current, comprising:

  • a system voltage source that is used to develop a reference voltage;

    a wire bond structure connected between the system voltage source and a power amplifier, where a sense voltage developed across the wire bond structure is indicative of a current flowing through the power amplifier;

    a current source configured to compensate the reference voltage for changes in resistance of the wire bond structure due to a temperature coefficient of the wire bond structure; and

    a comparator configured to receive the reference voltage and the sense voltage so as to compare the current flowing through the power amplifier to a current limit threshold, the comparator configured to generate a saturation control signal for reducing a bias applied to the power amplifier when the sense voltage exceeds the reference voltage so as to clamp the current flowing through the power amplifier at the current limit threshold.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×