IMAGING APPARATUS

• US 20110298925A1
• Filed: 06/06/2011
• Published: 12/08/2011
• Est. Priority Date: 06/07/2010
• Status: Active Grant

• Current Assignee: Ricoh Company Limited
• Original Assignee: Ricoh Company Limited
• Inventors: Sasaki, Norihiko, Nakajima, Mitsuru, Inoue, Tokiko
• Granted Patent: US 8,970,700 B2
• Time in Patent Office: Days
• US Class Current: 348/148
• CPC Class Codes: G03B 17/55 with provision for heating or cooling, e.g. in aircraft
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/52 Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

An imaging apparatus includes: an electronic circuit unit (30) including an imaging device (31) to acquire an object image formed by an imaging optical system (20); and a housing member (13) housing the electronic circuit unit (30). The electronic circuit unit (30) includes a thermally-conductive heat transfer member (37) in contact with an outer peripheral surface thereof which is in parallel with a fitting direction of the electronic circuit unit (30) into the housing member (13). The heat transfer member (37) includes a soft material portion (37b) in contact with the outer peripheral surface of the electronic circuit unit (37), and a plate portion (37a) in contact with the soft material portion (37b) and an inner peripheral wall surface of the housing member (13). The soft material portion (37b) is made of a shape-conformable member.

Claims

1. An imaging apparatus comprising:

a housing member having an opening; and

an electronic circuit unit housed in the housing member through the opening and including an imaging device to acquire an object image formed by an imaging optical system, wherein

the electronic circuit unit includes a thermally-conductive heat transfer member in contact with an outer peripheral surface thereof which is in parallel with a fitting direction of the electronic circuit unit into the housing member,

the heat transfer member includes a soft material portion in contact with the outer peripheral surface of the electronic circuit unit, and a plate portion in contact with the soft material portion and an inner peripheral wall surface of the housing member; and

the soft material portion is made of a shape-conformable member.

2. The imaging apparatus according to claim 1, wherein

the electronic circuit unit includes an electromagnetic shielding plate forming the outer peripheral surface, and

the soft material portion of the heat transfer member is in contact with the electromagnetic shielding plate.

3. The imaging apparatus according to claim 1, wherein

the heat transfer member is formed as a first heat transfer member, and

the electronic circuit unit includes:

at least one circuit board which has one or more electronic components mounted thereon and is provided to be perpendicular to the fitting direction; and

a thermally-conductive second heat transfer member which extends along the circuit board and thermally connects the electronic components and the first heat transfer member.

4. The imaging apparatus according to claim 3, wherein the second heat transfer member is made of a shape-conformable member.

5. The imaging apparatus according to claim 3, wherein

the electronic circuit unit includes an electromagnetic shielding plate that forms the outer peripheral surface,

the soft material portion of the first heat transfer member is in contact with the electromagnetic shielding plate, and

the second heat transfer member is in contact with the electromagnetic shielding plate in a direction perpendicular to the fitting direction.

6. The imaging apparatus according to claim 1, wherein

the soft material portion has an adhesive property, and

the soft material portion and the plate portion adhere to each other by adhesive force of the soft material portion.

7. The imaging apparatus according to claim 1, wherein the soft material portion of the heat transfer member adheres to the outer peripheral surface of the electronic circuit unit with a thermally-conductive adhesive member interposed therebetween.

8. The imaging apparatus according to claim 2, wherein the electromagnetic shielding plate and the plate portion include positioning engagement portions engaging with each other to prevent relative displacement between the electromagnetic shielding plate and the plate portion in the fitting direction.

9. The imaging apparatus according to claim 3, wherein the second heat transfer member is in contact with any of the electronic components which has a large amount of heat generation.

10. The imaging apparatus according to claim 1, wherein the soft material portion is made of silicone.

11. The imaging apparatus according to claim 3, wherein the second heat transfer member is made of silicone.

12. An in-vehicle camera using the imaging apparatus according to claim 1.