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PACKAGING FOR A MILLIMETER WAVE RADIO-FREQUENCY INTEGRATED CIRCUIT (RFIC)

  • US 20110299256A1
  • Filed: 06/02/2010
  • Published: 12/08/2011
  • Est. Priority Date: 06/02/2010
  • Status: Active Grant
First Claim
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1. Millimeter wave radio-frequency integrated circuit device, comprisinga housing and a radio frequency integrated circuit;

  • the housing comprising a plurality of layers laminated together and a first cavity defined within said laminated layers, the radio frequency integrated circuit being located within said first cavity.

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