PACKAGING FOR A MILLIMETER WAVE RADIO-FREQUENCY INTEGRATED CIRCUIT (RFIC)
First Claim
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1. Millimeter wave radio-frequency integrated circuit device, comprisinga housing and a radio frequency integrated circuit;
- the housing comprising a plurality of layers laminated together and a first cavity defined within said laminated layers, the radio frequency integrated circuit being located within said first cavity.
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Abstract
Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.
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Citations
24 Claims
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1. Millimeter wave radio-frequency integrated circuit device, comprising
a housing and a radio frequency integrated circuit; the housing comprising a plurality of layers laminated together and a first cavity defined within said laminated layers, the radio frequency integrated circuit being located within said first cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a radio-frequency integrated circuit device, comprising:
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machining apertures into a series of laminate layers; laminating together said series of laminate layers such that said apertures form a first cavity; placing a radio frequency integrated circuit into said cavity; and sealing said cavity. - View Dependent Claims (18, 19, 20)
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21. Housing for a millimeter wave radio-frequency integrated circuit device, comprising:
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a plurality of layers laminated together; and a first cavity defined within said laminated layers, said millimeter wave radio frequency integrated circuit being locatable within said first cavity. - View Dependent Claims (22, 23, 24)
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Specification