METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER

• US 20110300647A1
• Filed: 06/06/2011
• Published: 12/08/2011
• Est. Priority Date: 06/08/2010
• Status: Active Grant

• Current Assignee: Stmicroelectronics Tours SAS (STMicroelectronics NV)
• Original Assignee: Stmicroelectronics Tours SAS (STMicroelectronics NV)
• Inventors: Jarry, Vincent, Hougron, Patrick, Touzet, Dominique, Mendez, José
• Granted Patent: US 8,409,967 B2
• Time in Patent Office: Days
• US Class Current: 438/14
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/683 for supporting or gripping for conveying H01L21/677, for positioning, orientation or alignment H01L21/68
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: Y10T 225/393 Web restrainer
• CPC Class Codes: Y10T 83/02 Other than completely through work thickness

Abstract

A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.

Claims

1. A method for manufacturing semiconductor chips from a semiconductor wafer, comprising the steps of:

a) fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame;

b) arranging the wafer on a surface of a film stretched on the second frame;

c) carrying out wafer processing operations by using equipment capable of receiving the first frame;

d) separating the second frame from the first frame and removing the first frame; and

e) carrying out wafer processing operations by using equipment capable of receiving the second frame.

2. The method of claim 1, wherein the processing operations carried out at step c) comprise a step during which the wafer is cut into semiconductor chips and at least one semiconductor chip test step.

3. The method of claim 1, wherein the operations carried out at step e) comprise a step of mounting the semiconductor chips in electronic devices.

4. The method of claim 1, wherein the first frame comprises, on the side of a surface, guiding and fastening means capable of receiving the second frame, said guiding and fastening means being contained, in top view, within the outer contour of the first frame.

5. The method of claim 4, wherein the outer and inner contours of the first frame respectively have a square general shape with rounded corners and a circular shape.

6. The method of claim 5, wherein said guiding and fastening means comprise:

three guide rails fastened in the vicinity of three sides of the square forming the outer contour of the first frame, these guide rails delimiting a space inside of which the second frame is capable of being inserted; and

a removable lug capable of being fastened in the vicinity of the fourth side of the square forming the outer contour of the first frame.

7. The method of claim 6, wherein step a) comprises the operations of:

removing the removable lug from the first frame;

inserting the second frame between the guide rails of the first frame; and

fastening the removable lug to the first frame.

8. The method of claim 6, wherein step d) comprises the operations of:

removing the removable lug from the first frame; and

removing the second frame from the guide rails of the first frame.

9. A support frame for a semiconductor wafer, comprising, on the side of a surface, fastening means capable of receiving a second frame of outer dimensions respectively smaller than and greater than the outer and inner dimensions of the support frame, said fastening means being contained, in top view, within the outer contour of the support frame, wherein the support frame has an outer contour of generally square shape with rounded corners and a circular inner contour, said fastening means comprising:

three guide rails fastened in the vicinity of three sides of the square forming the outer contour of the support frame, these guide rails delimiting a space inside of which the second frame is capable of being inserted; and

a removable lug capable of being fastened in the vicinity of the fourth side of the support frame.