METHOD FOR THE MINIATURIZABLE CONTACTING OF INSULATED WIRES

• US 20110303341A1
• Filed: 12/08/2009
• Published: 12/15/2011
• Est. Priority Date: 12/09/2008
• Status: Active Grant

• Current Assignee: Technische Universitã¤T Darmstadt
• Original Assignee: Roland Werthschutzky
• Inventors: Meiss, Thorsten, Rossner, Tim
• Granted Patent: US 8,418,911 B2
• Time in Patent Office: Days
• US Class Current: 156/51
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/43 Manufacturing methods
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/4556 Disposition, e.g. coating on a part of the core
• CPC Class Codes: H01L 2224/45644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45647 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45655 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4845 Details of ball bonds
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/85214 using a laser
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/43 : Manufacturing methods
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01016 : Sulfur [S]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns

Abstract

The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprising a defined size of the electrically conductive area and allowing the contacting of very stably insulated wires. The application of this method in a panelized manner and in series is inexpensive.

Claims

1. A method for contacting insulated electrical wires, comprising

forming a cross-sectional surface by cutting, and

applying a ball-shaped or mushroom-shaped coating to the cross-sectional surface by means of a coating process which takes place at temperatures below the melting temperature of the alloy components of the materials and below the temperature at which the insulation is destroyed, so that a defined contact region is formed by the coating on the wire and the wire comprises an enlarged diameter at the contact area due to the coating.

2. The method according to claim 1, wherein the cross-sectional surface is exposed or formed by varying the cutting angle of the tool or by crushing the wire to create an electrically conductive surface which is smaller than, equal to, or larger than the previous cross-sectional surface of the wire.

3. The method according to claim 1, wherein the coating of the contact area takes place electrochemically by galvanic coating, chemically reductive coating, immersion, or a combination of these methods.

4. The method according to claim 1, wherein the coating of the contact area comprises an increased surface roughness and an adapted surface activity.

5. The method according to claim 1, wherein the contacting of the wire with a component takes place by means of a contact auxiliary.

6. The method according to claim 1, wherein the contacting of the wire with a component takes place without contact auxiliary by means of welding methods.

7. The method according to claim 1, wherein one or more wires are processed simultaneously on a carrier.

8. The method according to claim 1, wherein one or more wires are processed simultaneously without a carrier.

9. The method according to claim 1, wherein the electrical insulation is removed after processing and uninsulated wires with a very precisely defined contact region are able to be used for the contacting of components.

10. The method according to claim 4, further comprising generating the increased surface roughness and the adapted surface activity of the coating of the contact area by self-enhancing tip growth due to electrostatic field magnification at tips, electrochemical roughening or a hydrophilic or hydrophobic additional coating in order to simplify a dosing of a contact auxiliary.

11. The method according to claim 5, wherein the contact auxiliary comprises solder or electrically conductive glue.

12. The method according to claim 6, wherein the welding methods include ultrasonic welding—

bonding—

or laser welding.