Housing for an Optoelectronic Component

• US 20110303944A1
• Filed: 08/31/2009
• Published: 12/15/2011
• Est. Priority Date: 09/22/2008
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Arndt, Karlheinz
• Granted Patent: US 8,558,271 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A housing (1) for an optoelectronic component is indicated. The housing (1) comprises a housing body (2) and first and second electrical terminal strips (11, 12), which extend in part inside the housing body (2) and are guided out of the housing body (2) at a first side face (4a). Outside the housing body (2) the two terminal strips (11, 12) are bent in such a way that they comprise a first portion (11c, 12c), which extends at an angle to the first side face (4a), and a second portion (11d, 12d), which extends with spacing (D) along the first side face (4a). A method for producing such a housing (1) is also indicated.

Claims

1. A housing for an optoelectronic component comprising:

a housing body, which comprises a first side face, which is arranged at an angle to a front and a back of the housing body; and

first and second electrical terminal strips for supplying an optoelectronic semiconductor chip with electricity, which strips extend in part inside the housing body, are guided out of the housing body at the first side face and are bent outside the housing body in such a way that they comprise a first portion, which extends at an angle to the first side face, and a second portion, which extends with a spacing greater than zero along the first side face.

2. The housing according to claim 1, wherein the spacing between the first side face and the second portions of the terminal strips is between 0.4 mm and 0.6 mm in size.

3. The housing according to claim 1, wherein the first and second portions form an angle which is greater than 90°

.

4. The housing according to claim 1, wherein the terminal strips are at least 0.2 mm thick.

5. The housing according to claim 1, which comprises supporting elements which are connected to the housing body and project out of the plane of the first side face,

wherein the supporting elements have a height (H) which corresponds at least to the spacing of the second portions from the first side face plus the thickness (S) of the terminal strips.

6. The housing according to claim 1, wherein the supporting elements have an elongate shape and extend from the front to the back of the housing body and wherein the supporting elements form a tunnel-like cavity, in which the terminal strips are located.

7. The housing according to claim 1, wherein the housing body comprises a second, square-shaped side face arranged parallel to the first side face.

8. The housing according to claim 1, wherein the housing body comprises a third and fourth side wall arranged at an angle to the first side face, which third and fourth side walls are each provided with an opening.

9. The housing according to claim 1, wherein the openings lead into a rear cavity in the housing body.

10. The housing according to claim 1, wherein the two terminal strips are separated from one another by a gap which is smaller than the width of the supporting elements.

11. The housing according to claim 1, wherein the housing body comprises a recess at the front, which is provided for accommodating the optoelectronic semiconductor chip.

12. The housing according to claim 1, wherein an extension of the first terminal strip extending inside the housing body projects into the recess.

13. A side emitting component having a housing according to claim 1, and a radiation emitting semiconductor chip arranged inside the housing body, wherein the component is arranged on a terminal carrier in such a way that the second portions of the terminal strips extend along the terminal carrier and are connected to the terminal carrier by an electrically conductive joining agent.

14. A method of producing a housing according claim 1, having comprising the following steps:

introducing a terminal frame with a first and a second flat terminal strip into a shaping device, a first and a second portion of the terminal strips in each case projecting out of the device; and

filling the device with a housing body compound for forming the housing body, in such a way that the terminal strips are at least partially embedded in the housing body compound,

wherein the terminal strips are provided with a bend before or after completion of the housing body, such that in each case the first portion extends at an angle to the second portion.

15. A method according to claim 14, wherein the housing body is made from a the illoplastic by means of an injection moulding method.