ELECTRICALLY CONNECTING ROUTES OF SEMICONDUCTOR CHIP PACKAGE CONSOLIDATED IN DIE-ATTACHMENT

• US 20110304041A1
• Filed: 07/07/2010
• Published: 12/15/2011
• Est. Priority Date: 06/15/2010
• Status: Abandoned Application

• Current Assignee: Powertech Technology Inc
• Original Assignee: Powertech Technology Inc
• Inventors: CHUNG, Chi-Yuan
• Application Number:
  US12/831,578
• Publication Number:
  US 20110304041A1
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/06155 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48647 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48824 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48847 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/73215 : Layer and wire connectors
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06562 : at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/42 : Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/04 : Structure, shape, material or disposition of the bonding areas prior to the connecting process
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A chip package comprises a chip, a plurality of bumps, and a die-attaching tape where the bumps are jointed to the corresponding bonding pads on the active surface of the chip. The die-attaching tape consists of a wiring core, a first dielectric adhesive, and a second dielectric adhesive where the wiring core is sandwiched between the first dielectric adhesive and the second dielectric adhesive. The wiring core is of a thickness of a dielectric material and includes a plurality of conductive traces separated by the dielectric material. The conductive traces are also of the thickness of the dielectric material. The die-attaching tape is attached to the active surface of the chip by the first dielectric adhesive to make the bumps penetrate the first dielectric adhesive and joint to the corresponding conductive traces. Therefore, the die-attaching tape can have both functions of holding the chip and transversely transmitting signals to substrate or another chip to eliminate or reduce the conventional wire-bonding processes.

Claims

1. A chip package comprising:

a first chip having a first active surface, an opposing first back surface and a plurality of first bonding pads disposed on the first active surface;

a plurality of first bumps jointed onto the first bonding pads; and

a die-attaching tape attached to the first active surface of the first chip, the die-attaching tape consisting of a first dielectric adhesive, a second dielectric adhesive and a wiring core sandwiched between the first dielectric adhesive and the second dielectric adhesive, wherein the wiring core is of a thickness of a dielectric material and includes a plurality of conductive traces separated by the dielectric material, wherein the conductive traces are also of the thickness of the dielectric material;

wherein the first dielectric adhesive is adhered to the first active surface with the first bumps penetrating through the first dielectric adhesive and jointing to the corresponding conductive traces.

2. The chip package as claimed in claim 1, wherein the conductive traces are parallel straight lines and the orientation of the conductive traces is perpendicular to the orientation of the first bonding pads.

3. The chip package as claimed in claim 1, wherein the first bumps are stud bumps formed by wire-bonding processes with extruded wire tips to be embedded into the conductive traces.

4. The chip package as claimed in claim 1, further comprising an encapsulant encapsulating the first chip and the die-attaching tape.

5. The chip package as claimed in claim 1, further comprising a substrate and a plurality of substrate bumps disposed on a plurality of bonding fingers on the substrate, wherein the first chip are disposed on the substrate and the die-attaching tape is extended from the first chip and is further attached to the substrate to make the first dielectric adhesive adhere to the substrate with the substrate bumps penetrating through the first dielectric adhesive and jointing to the corresponding conductive traces.

6. The chip package as claimed in claim 5, further comprising:

a second chip having a second active surface, an opposing second back surface and a plurality of second bonding pads disposed on the second active surface; and

a plurality of second bumps jointed onto the second bonding pads;

wherein the first chip and the second chip are face-to-face stacked together so that the second dielectric adhesive is adhered to the second active surface with the second bumps penetrating through the second dielectric adhesive and jointing to the corresponding conductive traces.

7. The chip package as claimed in claim 5, further comprising:

a second chip having a second active surface, an opposing second back surface and a plurality of second bonding pads disposed on the second active surface; and

a plurality of second bumps jointed onto the second bonding pads;

wherein the first chip and the second chip are stair-like stacked together so that two sides of the die-attaching tape are extended over the first active surface of the first chip to make the first dielectric adhesive adhere to the second active surface with the second bumps penetrating through the first dielectric adhesive and jointing to the corresponding conductive traces.

8. The chip package as claimed in claim 1, wherein the die-attaching tape does not extend over the first active surface of the first chip.

9. The chip package as claimed in claim 8, further comprising:

a substrate having a plurality of bonding fingers;

a second chip having a second active surface, an opposing second back surface and a plurality of second bonding pads disposed on the second active surface, wherein the second back surface of the second chip is attached onto the substrate; and

a plurality of bonding wires connecting the second bonding pads to the bonding fingers with a plurality of ball bonds of the bonding wires jointed onto the second bonding pads;

wherein the first chip and the second chip are face-to-face stacked together so that the second dielectric adhesive adheres to the second active surface with the ball bonds of the bonding wires penetrating through the second dielectric adhesive and jointing to the corresponding conductive traces.

10. The chip package as claimed in claim 9, wherein the bonding wires are copper wires.

11. The chip package as claimed in claim 1, wherein the pitch of the first bonding pads is equal to the pitch of the conductive traces.

12. The chip package as claimed in claim 1, wherein the pitch of the first bonding pads is integral multiples of the pitch of the conductive traces so that at least half of the conductive traces are not connected with the first bonding pads.

13. The chip package as claimed in claim 1, wherein the first dielectric adhesive and the second dielectric adhesive are resins with the characteristic of multiple curing stages.

14. The chip package as claimed in claim 13, wherein the Tg of the first dielectric adhesive is greater than the Tg of the second dielectric adhesive.